现行

SJ/T 10753-2015

电子器件用金、银及其合金钎料
Gold,silver and their alloy brazing for electron device

2015-10-10

现行

SJ/T 10754-2015

电子器件用金、银及其合金钎料分析方法 清洁性、溅散性的测定
Test methods for gold,silver and their alloy brazing for electron device Determination of cleanness,spatter

2015-10-10

现行

YS/T 1070-2015

真空断路器用银及其合金钎料环
Silver and their alloy brazing filler ring materials for vacuum switching devices

2015-04-30

现行

SJ/T 11030-2015

电子器件用金铜及金镍纤料中杂质 铅、锌、磷的ICP-AES测定方法
Test method for lead,phosphorus and zinc in gold copper and gold nickel brazing for electron device by ICP-AES

2015-10-10

现行

SJ/T 11029-2015

电子器件用金镍纤料的分析方法 EDTA容量法测定镍
Analytical methods for gold nickel brazing for electron device Determination of nickel by EDTA volumetry

2015-10-10

现行

SJ/T 11028-2015

电子器件用金铜钎料的分析方法 EDTA容量法测定铜
Analytical methods for gold copper brazing for electron device Determination of copper by EDTA volumetry

2015-10-10

现行

SJ/T 11018-2016

电子器件用纯银钎料的分析方法 燃烧碘量法测定硫
Analytical methods for pure silver brazing for electron device Determination of sulphur by combustion-iodimetry

2016-01-15

现行

SJ/T 11020-1996

电子器件用银铜钎焊料的分析方法 碘量法测定铜
Methods of analysis for silver-copper brazing for electronic devices--Determination of copper (iodimetric method)

1996-11-20

现行

SJ/T 11027-1996

电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定镁
Methods of analysis for silver-copper brazing for electronic devices--Determination of magnesium (spectrophotometric-atomic absorption method)

1996-11-20

现行

SJ/T 11025-1996

电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铅
Methods of analysis for silver-copper brazing for electronic devices--Determination of lead (spectrophotometric-atomic absorption method)

1996-11-20

现行

SJ/T 11023-1996

电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铋
Methods of analysis for silver-copper brazing for electronic devices--Determination of bismuth (spectrophotometric-atomic absorption method)

1996-11-20

现行

SJ/T 11022-1996

电子器件用银铜钎焊料的分析方法 邻基二酚紫－溴化十六烷基吡啶分光光度法测定锡
Methods of analysis for silver-copper brazing for electronic devices--Determination of tin (spectrophotometric C21H38BrN absorption method)

1996-11-20

现行

SJ/T 11024-1996

电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定锑
Methods of analysis for silver-copper brazing for electronic devices--Determination of antimony (spectrophotometric-atomic absorption method)

1996-11-20

现行

SJ/T 11026-1996

电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铁、镉、锌
Methods of analysis for silver-copper brazing for electronic devices--Determination of iron,cadmium and zinc (spectrophotometric-atomic absorption method)

1996-11-20

现行

SJ/T 11011-2015

电子器件用纯银纤料中杂质含量铅、铋、锌、镉、铁、镁、铝、锡、锑、磷的ICP-AES测定方法
Test method for lead,bismuth,zinc,cadmium,iron,magnesium,aluminium,tin,antimony and phosphorus in pure silver brazing for electron device by ICP-AES

2015-10-10

现行

SJ/T 11021-1996

电子器件用银铜钎焊料的分析方法 铅、铋、锌、镉、铁、镁、铝、锡和锑的化学光谱测定
Methods of analysis for silver-copper brazing for electronic devices--Determination of Pb, Bi, Zn, Cd, Fe, Mg, Al, Sn and Sb (spectrochemical method)

1996-11-20