Technical procurement specification - Thick-film resistor pastes
技术采购规范-厚膜电阻浆料

1995-11-01

Technical procurement specification - Thick-film dielectric pastes
技术采购规范-厚膜介质浆料

1995-11-01

Soldering pastes - Part 1: Composition, technical specifications
焊膏.第1部分:成分和技术规范

2005-01-01

Draft Document - Technical procurement specification - Thick-film conductor pastes
文件草案-技术采购规范-厚膜导体浆料

1995-11-01

膏状软钎料规范
Paste soft solder specification

2015-04-30

微波组件印制板焊膏印刷工艺技术要求
Technical requirements for pasting solder on PCB of microwave assembly

2018-01-18

锡膏厚度测量仪校准规范
Calibration Specification for Solder Paste Inspection Instruments

2022-04-29

全尾砂膏体充填技术规范
Technical specification for the total tailings paste backfill

2020-11-19

Technical procurement specification; electrically conducting adhesives
技术采购规范；导电粘合剂

1994-02-01

煤矿膏体充填开采技术规范
Technical specification for paste filling mining in coal mine

2021-11-16

全尾砂膏体制备与堆存技术规范
Technical specification for total tailings paste production and disposal

2021-05-21

Technical procurement specification; electrically non-conductive adhesives
技术采购规范；非导电粘合剂

1994-02-01

Technical procurement specification - Epoxy encapsulants for semiconductor chips
技术采购规范.半导体芯片用环氧密封剂

1995-03-01

Standard Specification for Water Flushable Liquid and Paste Fluxes for Soldering of Copper and Copper Alloy Tube
铜和铜合金管焊接用水冲洗液体和糊状焊剂的标准规范

2024-07-01

煤矿膏体充填留巷开采技术规范
Technical specification for paste filling roadway retaining in coal mine

2021-11-16

Technical procurement specification; alumina substrates for thick-film circuits
技术采购规范；厚膜电路用氧化铝基板

1993-07-01

免焊螺口式灯头 技术要求
Solder-free screw caps Technical specification

2013-10-17

FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING MIL-F-14256E)
助焊剂 焊接 液体 焊膏助焊剂 焊膏和焊膏助焊剂（电子/电气用） 通用规范（由ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995 ANSI/J-STD-006-1995-1995代替MIL-F-14256E）

1993-04-26

FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING QPL-14256-87)
助焊剂 焊接 液体 焊膏助焊剂 焊膏和焊膏助焊剂（电子/电气用） 通用规范（ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995 ANSI/J-STD-006-1995-1995 取代QPL-14256-87）

1995-03-31

FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING MIL-F-14256E)
焊剂 液体 膏状焊剂 焊膏和焊料膏状焊剂（电子/电气用） 通用规范（ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995和ANSI/J-STD--006-1995-1995）（代替MIL-F-14256E）

1995-06-15