IEC TS 62132-9:2014提供了一个测试程序，该程序定义了评估近电场、磁场或电磁场组件对集成电路（IC）影响的方法。该诊断程序用于IC架构分析，如楼层规划和配电优化。本测试程序适用于测试安装在扫描探针可触及的任何电路板上的IC。在某些情况下，不仅扫描IC，而且扫描其环境也是有用的。为了比较不同IC之间的表面扫描抗扰度，应使用IEC 62132-1中定义的标准化测试板。 这种测量方法提供了对IC上的电场或磁场近场干扰的灵敏度（抗扰度）的映射。测试的分辨率由测试探针的能力和探针定位系统的精度决定。该方法适用于高达6 GHz的环境。使用现有探头技术可以扩展频率上限，但超出了本规范的范围。本文件中描述的测试在频域中使用连续波（CW）、调幅（AM）或脉冲调制（PM）信号进行。

IEC TS 62132-9:2014 provides a test procedure, which defines a method for evaluating the effect of near electric, magnetic or electromagnetic field components on an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to testing an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is useful to scan not only the IC but also its environment. For comparison of surface scan immunity between different ICs, the standardized test board defined in IEC 62132-1 should be used. This measurement method provides a mapping of the sensitivity (immunity) to electric- or magnetic-near-field disturbance over the IC. The resolution of the test is determined by the capability of the test probe and the precision of the Probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this specification. The tests described in this document are carried out in the frequency domain using continuous wave (CW), amplitude modulated (AM) or pulse modulated (PM) signals.