IEC TS 62686-1:20 20作为IEC TS 62686-1:20 20 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC TS 62686-1:20 20定义了用于ADHP（航空航天、国防和高性能）应用的通用“现成”COTS（商用现成）集成电路和分立半导体的最低要求。本技术规范适用于在制造商公开提供的数据表和IEC TS 62239-1范围内可在ADHP应用中运行的所有组件。它可以由其他高性能和高可靠性行业自行决定使用。与上一版相比，此新版本包括以下重大技术变更:-与堆叠规范S/0001修订版14通知3过时相关的更新； -增加替代的汽车合规方法和修订附件B，最初涉及堆叠规范S/0001的交叉引用； -增加附录C，包括IEC TS 62686-1验证的要求矩阵。

IEC TS 62686-1:2020 is available as IEC TS 62686-1:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC TS 62686-1:2020 defines the minimum requirements for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (aerospace, defence and high performance) applications. This Technical Specification applies to all components that can be operated in ADHP applications within the manufacturers' publicly available data sheet limits in conjunction with IEC TS 62239-1. It may be used by other high performance and high reliability industries, at their discretion. This new edition includes the following significant technical changes with respect to the previous edition:
- update related to obsolescence of STACK Specification S/0001 revision 14 notice 3;
- addition of alternative automotive methods of compliance and revision of Annex B initially related to cross-reference to STACK Specification S/0001;
- addition of an Annex C to include a requirement matrix for IEC TS 62686-1 verification.