本标准规定了印刷电路板制造文件的要求，并确定了未填充产品的物理属性和性能要求。这些描述适用于刚性、柔性、无机基质或其任何组合。结构可以是单层、双层、多层或HDI技术，也可以包括嵌入式（集成）组件。这些要求涉及硬拷贝和电子数据描述。

This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorganic substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated) components. The requirements pertain to both hard copy and electronic data descriptions.