1.1本规程概述了在使用传统电子光谱仪获得的给定俄歇光谱中识别元素的必要步骤。考虑了显示为电子能量分布（直接光谱）或电子能量分布一阶导数的光谱。 1.2本规程适用于电子或X射线轰击试样表面产生的俄歇光谱，并可扩展到其他方法（如离子轰击）产生的光谱。 1.3以国际单位制表示的数值应视为标准值。本标准不包括其他计量单位。 1.4 本标准并非旨在解决与其使用相关的所有安全问题（如有）。本标准的用户有责任在使用前制定适当的安全和健康实践，并确定监管限制的适用性。 ====意义和用途====== 俄歇分析用于确定试样表面前几个原子层的元素组成，通常为1至5nm厚。结合惰性气体离子溅射，它用于确定几微米深度的溅射深度剖面。 试样通常为固体导体、半导体或绝缘体。对于绝缘子，可能需要规定表面电荷累积的控制（见指南E 1523 ). 典型应用包括分析金属或合金基底上的表面污染物、薄膜沉积物或隔离覆盖层。试样形貌可能从光滑、抛光的试样到粗糙的断裂面不等。 在俄歇室的超高真空环境中蒸发的挥发性物质和易受电子或X射线影响的物质样品的俄歇分析- 射线束损伤，如有机化合物，可能需要本文未涵盖的特殊技术。（见指南E 983 .)

1.1 This practice outlines the necessary steps for the identification of elements in a given Auger spectrum obtained using conventional electron spectrometers. Spectra displayed as either the electron energy distribution (direct spectrum) or the first derivative of the electron energy distribution are considered. 1.2 This practice applies to Auger spectra generated by electron or X-ray bombardment of the specimen surface and can be extended to spectra generated by other methods such as ion bombardment. 1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. ====== Significance And Use ====== Auger analysis is used to determine the elemental composition of the first several atomic layers, typically 1 to 5 nm thick, of a specimen surface. In conjunction with inert gas ion sputtering, it is used to determine the sputter depth profile to a depth of a few micrometres. The specimen is normally a solid conductor, semiconductor, or insulator. For insulators, provisions may be required for control of charge accumulation at the surface (see Guide E 1523 ). Typical applications include the analysis of surface contaminants, thin film deposits or segregated overlayers on metallic or alloy substrates. The specimen topography may vary from a smooth, polished specimen to a rough fracture surface. Auger analysis of specimens with volatile species that evaporate in the ultra-high vacuum environment of the Auger chamber and substances which are susceptible to electron or X-ray beam damage, such as organic compounds, may require special techniques not covered herein. (See Guide E 983 .)