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现行 BS 6221-9:1991
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Printed wiring boards-Specification for flexible multilayer boards with through connections 印刷线路板 带贯穿连接的挠性多层板规范
发布日期: 1991-09-30
与电路板有关,无论其制造方法如何。本协议旨在作为买卖双方达成协议的基础。定义要评估的特性、要使用的测试方法,并建立判断性能和尺寸的统一要求。所使用的术语“相关规范”指此类协议。不适用于扁平电缆。交叉引用:BS 2011:第2.1部分ABS 2011:第2.1部分BS 2011:第2.1Z/ADBS 6221:第2BS 6221:第3IEC 194IEC 321部分
Relates to boards irrespective of their method of manufacture. It is intended as a basis on which agreements between purchaser and vendor can be made. Defines the characteristics to be assessed, the test methods to be used and establishes uniform requirements for judging properties and dimensions. The term 'relevant specification' used refers to such agreements. Not applicable to flat cables.Cross References:BS 2011:Part 2.1CaBS 2011:Part 2.1TBS 2011:Part 2.1Z/ADBS 6221:Part 2BS 6221:Part 3IEC 194IEC 321
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发布单位或类别: 英国-英国标准学会
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BS 6221-6-1982
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DIN EN 123800
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BS EN 123800-1997
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BS 4584-103.1-1990
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