Draft Document - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin (IEC 107/160/DTS:2011)
文件草稿.航空电子设备的过程管理.含无铅焊料的航空航天和国防电子系统.第2部分:锡有害影响的缓解(IEC 107/160/DTS:2011)