现行

MIL MIL-PRF-31032/4D

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
多层印刷线路板 刚柔 带电镀通孔 带或不带加强筋 用于焊接部件安装

2020-04-04

现行

MIL MIL-PRF-31032/4C Amendment 2

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2018-07-14

现行

MIL MIL-PRF-31032/4A Amendment 3

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2008-04-15

现行

MIL MIL-PRF-31032/4C Amendment 1

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2018-01-08

现行

MIL MIL-PRF-31032/4B Amendment 1

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2012-11-04

现行

MIL MIL-PRF-31032/4A Amendment 4

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2009-06-10

现行

MIL MIL-PRF-31032/4B Amendment 2

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2013-06-24

现行

MIL MIL-PRF-31032/3D

Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
挠性印刷线路板 单层和双层 带或不带电镀通孔 带或不带加强筋 用于焊接部件安装

2020-04-03

现行

MIL MIL-PRF-31032/3C Amendment 1

Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用单层和双层柔性印刷线路板 带或不带镀通孔 带或无加强筋

2018-06-13

现行

MIL MIL-PRF-31032/3A Amendment 3

Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-Through Holes, with or without Stiffeners for Soldered Part Mounting
软性印刷线路板 单层和双层 带或不带电镀通孔 有或不带焊接部件安装用加强件

2008-04-23

现行

MIL MIL-PRF-31032/3B Amendment 1(amendment incorporated)

Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用单层和双层柔性印刷线路板 带或不带镀通孔 带或无加强筋

2012-11-03

现行

MIL MIL-PRF-31032/3A Amendment 4(all prev amd incorp.)

Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用单层和双层柔性印刷线路板 带或不带镀通孔 带或无加强筋

2009-06-10

现行

MIL MIL-PRF-31032/1D

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
印刷线路板 刚性多层热固性树脂基材 带或不带盲板和埋入式电镀通孔 用于焊接部件安装

2017-06-01

现行

MIL MIL-PRF-31032/2D

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
印刷线路板 刚性 单层和双层 热固性树脂基材 带或不带电镀通孔 用于焊接部件安装

2020-03-02

现行

MIL MIL-PRF-31032/1C Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
印刷电路板 刚性 多层 热固性树脂基材 带或不带盲孔和埋地电镀通孔 用于焊接部件安装

2012-11-01

现行

MIL MIL-PRF-31032/2A Amendment 4(all prev amd incorp.)

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
印刷接线板 刚性 单层和双层 热固性树脂基材 带或不带电镀孔 用于焊接部件安装

2009-07-04

现行

MIL MIL-PRF-31032/1D Amendment 2

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印刷线路板 带或不带盲板和埋板通孔

2018-07-11

现行

MIL MIL-PRF-31032/2C Amendment 1

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基刚性单层和双层印刷线路板

2018-06-12

现行

MIL MIL-PRF-31032/2A Amendment 3

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基材刚性单层和双层印刷线路板

2008-04-23

现行

MIL MIL-PRF-31032/1B Amendment 3

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印制线路板 带或不带盲板和埋板通孔

2008-04-15