IEC 62951-3:2018-半导体器件 - 柔性和可拉伸半导体器件 - 第3部分:凸出下柔性基板上薄膜晶体管特性的评估-国家数字标准馆

现行 IEC 62951-3:2018

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Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics on flexible substrates under bulging 半导体器件 - 柔性和可拉伸半导体器件 - 第3部分:凸出下柔性基板上薄膜晶体管特性的评估

发布日期： 2018-11-07

IEC？62951-3:2018（E）规定了在鼓胀状态下评估柔性基板上薄膜晶体管特性的方法。薄膜晶体管是在柔性衬底上制造的，包括聚对苯二甲酸乙二醇酯（PET）、聚酰亚胺（PI）、弹性体等。通过使用该设备向柔性基板施加均匀分布的压力来施加应力。

IEC？62951-3:2018(E) specifies the method for evaluating thin film transistor characteristics on flexible substrates under bulging. The thin film transistor is fabricated on flexible substrates, including polyethylene terephthalate (PET), polyimide (PI), elastomer and others. The stress is applied by applying a uniformly-distributed pressure to the flexible substrate using the equipment.

分类信息

发布单位或类别：国际组织-国际电工委员会

ICS分类： 31.080.99半导体分立器件 - 其他半导体分立器件

关联关系

研制信息

归口单位： TC 47

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