现行

BS 11/30249344 DC

BS EN 62047-19. Semiconductor devices. Micro-electromechanical devices. Part 19. Electronic compasses
英国标准EN 62047-19 半导体器件 微型机电设备 第19部分 电子罗盘

2011-07-11

现行

BS 07/30172155 DC

BS EN 62047-5. Semiconductor devices. Micro-electromechanical devices. Part 5. RF MEMS switches
英国标准EN 62047-5 半导体器件 微型机电设备 第五部分 射频MEMS开关

2007-10-01

现行

BS 10/30211442 DC

BS EN 62047-10. Semiconductor devices. Micro electromechanical devices. Part 10. Micro-pillar compression test for MEMS materials
英国标准EN 62047-10 半导体器件 微型机电设备 第十部分 MEMS材料的微柱压缩试验

2010-03-11

现行

DIN EN 62047-14

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012
半导体器件.微机电器件.第14部分:金属薄膜材料的成形极限测量方法（IEC 62047-14-2012）；德文版EN 62047-14:2012

2012-10-01

现行

BS 08/30172394 DC

BS EN 62047-7. Semiconductor devices. Micro-electromechanical devices. P art 7. MEMS FBAR Filter & Duplexer
英国标准EN 62047-7 半导体器件 微型机电设备 P第7条 MEMS FBAR滤波器和双工器

2008-04-29

现行

BS 07/30172404 DC

BS EN 62047-9. Semiconductor devices. Micro-electromechanical devices. Part 9. Wafer to wafer bonding strength measurement for MEMS
英国标准EN 62047-9 半导体器件 微型机电设备 第九部分 MEMS晶片间键合强度的测量

2007-12-05

现行

BS 07/30148822 DC

BS IEC 62047-4. Semiconductor devices. Micro-electromechanical devices. Part 4. Generic specifications for MEMS
BS IEC 62047-4 半导体器件 微型机电设备 第四部分 微机电系统通用技术条件

2007-05-10

现行

DIN EN 62047-20

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014); German version EN 62047-20:2014
半导体器件.微机电器件.第20部分:陀螺仪（IEC 62047-20-2014）；德文版EN 62047-20:2014

2015-04-01

现行

DIN EN 62047-19

Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 62047-19:2013); German version EN 62047-19:2013
半导体器件.微机电器件.第19部分:电子罗盘（IEC 62047-19-2013）；德文版EN 62047-19:2013

2014-04-01

现行

DIN EN 62047-1

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016); German version EN 62047-1:2016
半导体器件.微机电器件.第1部分:术语和定义（IEC 62047-1-2016）；德文版EN 62047-1:2016

2016-12-01

现行

BS 10/30211446 DC

BS EN 62047-11. Semiconductor devices. Micro-electromechanical devices. Part 11. Test method for linear thermal expansion coefficients of MEMS materials
英国标准EN 62047-11 半导体器件 微型机电设备 第11部分 MEMS材料线性热膨胀系数的试验方法

2010-03-11

现行

DIN EN 62047-11

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013
半导体器件.微机电器件.第11部分:微机电系统用独立材料线性热膨胀系数的试验方法（IEC 62047-11-2013）；德文版EN 62047-11:2013

2014-04-01

现行

DIN EN 62047-10

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
半导体器件.微机电器件.第10部分:MEMS材料的微柱压缩试验（IEC 62047-10-2011）；德文版EN 62047-10:2011

2012-03-01

现行

DIN EN 62047-5

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (IEC 62047-5:2011); German version EN 62047-5:2011
半导体器件.微机电器件.第5部分:RF MEMS开关（IEC 62047-5-2011）；德文版EN 62047-5:2011

2012-03-01

现行

DIN EN 62047-4

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010
半导体器件.微机电器件.第4部分:MEMS总规范（IEC 62047-4-2008）；德文版EN 62047-4:2010

2011-03-01

现行

BS 10/30211454 DC

BS EN 62047-13. Semiconductor devices. Micro-electromechanical devices. Part 13. Bend- and shear- test methods of measuring adhesive strength for MEMS structures
英国标准EN 62047-13 半导体器件 微型机电设备 第13部分 测量MEMS结构粘接强度的弯曲和剪切试验方法

2010-02-22

现行

BS 08/30172398 DC

BS EN 62047-8. Semiconductor devices. Micro- electromechanical devices. Part 8. Strip bending test method for tensile property measurement of thin films
英国标准EN 62047-8 半导体器件 微型机电设备 第八部分 薄膜拉伸性能测量的带材弯曲试验方法

2008-02-18

现行

DIN EN 62047-26

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016
半导体器件.微机电器件.第26部分:微沟槽和针形结构的描述和测量方法（IEC 62047-26-2016）；德文版EN 62047-26:2016

2016-12-01

现行

DIN EN 62047-22

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
半导体器件.微机电器件.第22部分:柔性衬底上导电薄膜的机电拉伸试验方法（IEC 62047-22-2014）；德文版EN 62047-22:2014

2015-04-01

现行

DIN EN 62047-9

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
半导体器件.微机电器件.第9部分:MEMS用晶片间键合强度测量（IEC 62047-9-2011）；德文版EN 62047-9:2011

2012-03-01