现行

SJ/Z 21295-2018

多层印制板用芯板选用指南
Guide of selecting core constructions for multilayer printed circuit boards

2018-01-18

现行

BS 6221-12-1992

Printed wiring boards-Specification for mass lamination panels (semi-manufactured multilayer printed boards)
印刷线路板 大规模层压板（半成品多层印制板）规范

1992-11-15

现行

IPC ML-960

Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards
多层印制板用大规模层压板的鉴定和性能规范

1994-07-01

现行

MIL MIL-C-55302/51 Notice 1-Cancellation

CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: CARD GUIDE FOR SOCKET MOUNTING, FOR MULTILAYERED PRINTED WIRING BOARDS (NO S/S DOCUMENT)
连接器、印刷电路组件和附件:多层印刷线路板插座安装卡指南（无S/S文件）

1979-09-07

现行

GOST 23661-1979

Платы печатные многослойные. Требования к типовому технологическому процессу прессования
多层印刷电路板 对标准技术压制过程的要求

现行

SJ/Z 21089-2016

印制板镀铜指南
Guide for copper plating of printed circuit boards

2016-01-19

现行

SJ/Z 21087-2016

印制板钻孔指南
Guide for drilling processing of printed circuit boards

2016-01-19

现行

SJ/Z 21298-2018

印制板图形蚀刻指南
Guide of pattern etching for printed circuit boards

2018-01-18

现行

SJ/Z 21297-2018

印制板图形成像指南
Guide of pattern imaging for printed circuit boards

2018-01-18

现行

SJ 21085-2016

刚性多层印制板用粘结片规范
Specification for bonding sheet use in the fabrication rigid multilayer printed circuit boards

2016-01-19

现行

JIS C 6493-1999

Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
印制电路用基材多层印制板制造用规定可燃性的薄型聚酰亚胺编织玻璃纤维覆铜层压板

1999-01-01

现行

GB/T 4722-2017

印制电路用刚性覆铜箔层压板试验方法
Test methods for rigid copper clad laminates for printed circuits board

2017-05-31

现行

SJ/Z 21088-2016

印制板阻焊膜加工指南
Guide for solder mask processing of printed circuit boards

2016-01-19

现行

SJ/Z 21300-2018

印制板电镀镍金加工指南
Guide of nickel and goId plating for printed circuit boards

2018-01-18

现行

SJ/Z 21296-2018

印制板用照相底版制作和使用指南
Guide of phototool generation and use for printed circuit boards

2018-01-18

现行

SJ/Z 21284-2018

印制板导通孔保护设计指南
Design guide for via protection of printed circuit boards

2018-01-18

现行

UNE 20620-3-1-1981

METAL-CLAS BASE MATERIALS FOR PRINTED CIRCUITS. SPECIAL MATERIALS. SPECIFICATION NO.1: PRE-PREG FOR MULTILAYER PRINTED BOARDS
印刷电路板用金属覆层基材 特殊材料 规范1:多层印制板的预浸

1981-12-15

现行

JIS C 6494-1999

Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
印制电路用基材多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃纤维织物覆铜薄层压板

1999-01-01

现行

SJ/Z 21090-2016

印制板热风整平指南
Guide for hot air solder level processing of printed circuit boards

2016-01-19

现行

SJ/Z 21301-2018

印制板油墨标识加工指南
Guide fo r ink mark processing of printed circuit boards

2018-01-18