现行

KS F 3127(2018 Confirm)

내장용 플라스틱 치장 보드류
用于内部使用的塑料层压板或印刷板

2008-12-30

现行

JIS A 5703-1994

Plastic laminated or printed boards for inside use
室内用塑料层压或印制板

1994-01-01

现行

BS EN 61193-3-2013

Quality assessment systems-Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
质量评估系统

2013-06-30

现行

JIS C 6493-1999

Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
印制电路用基材多层印制板制造用规定可燃性的薄型聚酰亚胺编织玻璃纤维覆铜层压板

1999-01-01

现行

GOST R IEC 61193-3-2015

Системы оценки качества. Часть 3. Выбор и использование планов выборочного контроля печатных плат и слоистого материала как конечной продукции, а также во время технологического процесса
质量评估体系 第3部分选择和使用印刷电路板和层压板最终产品和进程内审核的采样计划

现行

IEC 61193-3-2013

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
质量评估系统 - 第3部分:印刷板和层压板最终产品和过程审核抽样计划的选择和使用

2013-01-24

现行

GB/T 12630-1990

一般用途的薄覆铜箔环氧玻璃布层压板 （制造多层印制板用）
Thin epoxide woven glass fabric copper-clad laminated sheet， general purpose grade， for use in the fabrication of multilayer printed boards

1990-12-28

现行

IEC 60852-2-1992

Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment - Part 2: Transformers and inductors using YEx-2 laminations for printed wiring board mounting
用于电信和电子设备的变压器和电感器的外形尺寸 - 第2部分:使用YEx-2叠片的变压器和电感器用于印刷线路板安装

1992-05-15

现行

JIS C 6494-1999

Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
印制电路用基材多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃纤维织物覆铜薄层压板

1999-01-01

现行

BS EN 60249-2-17-1993

Specifications-Specification No. 17. Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
规格

2001-06-15

现行

BS EN 60249-2-11-1994

Specifications-Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
规格

2001-06-15

现行

MIL MIL-P-13949/21 Notice 1-Cancellation

PLASTIC SHEET, LAMINATED, MATERIALS (FOR PRINTED WIRING BOARDS), BASE MATERIAL, AI, ARAMID, WOVEN, MAJORITY POLYIMIDE, RESIN, PREIMPREGNATED (B-STAGE) (NO S/S DOCUMENT)
塑料片 层压 材料（用于印制线路板） 基材 AI 芳纶 机织 大部分聚酰亚胺 树脂 预浸渍（B级）（无S/S文件）

1994-01-25

现行

KS C IEC 60249-2-11(2017 Confirm)

인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印制电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃纤维布覆铜层压板

2002-08-31

现行

KS C IEC 60249-2-11(2022 Confirm)

인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印刷电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃织物覆铜层压板

2002-08-31

现行

BS 09/30178203 DC

BS EN 61193-3. Quality assessment systems. Part 3. Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
英国标准EN 61193-3 质量评估系统 第三部分 印制板和层压板最终产品抽样计划的选择和使用以及过程中审计

2009-03-10

现行

UNE-EN 60249-2-12-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范12:多层印制板制造用规定可燃性的薄环氧玻璃纤维织物覆铜层压板

1996-07-24

现行

UNE-EN 60249-2-17-1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARD.
印刷电路的基材 第2部分:规范 规范Nº17:多层印制板制造用规定可燃性的薄聚酰亚胺编织玻璃纤维覆铜层压板

1997-08-11

现行

UNE-EN 60249-2-11-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范11:用于制造多层印制板的通用级薄环氧玻璃纤维织物覆铜层压板

1996-07-24

现行

DIN IEC 60852-2

Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment; part 2: transformers and inductors using YEx 2 laminations for printed wiring board mounting; identical with IEC 60852-2:1992
通信和电子设备用变压器和电感器的外形尺寸；第2部分:印刷线路板安装用YEx 2叠片变压器和电感器；与IEC 60852-2:1992相同

1994-02-01

现行

BS EN 60249-2-19-1993

Specifications-Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
规格 第19号规范 用于制造多层印制板的规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃纤维织物覆铜薄层压板

1992-09-15