IEC 60317-36:2013+AMD1:2019+AMD2:2024 CSV规定了具有双涂层的180级可焊接漆包圆铜绕组线的要求。底层涂层基于聚酯酰亚胺树脂，只要其保留原始树脂的化学特性并满足所有规定的电线要求，就可以对其进行改性。叠加涂层是基于热塑性树脂的粘合层。 注-改性树脂是经过化学变化的树脂，或含有一种或多种添加剂以增强某些性能或应用特性的树脂。本部分涵盖的公称导体直径范围为: -1B级:0,020 mm至1,600 mm并包括1,600 mm； -2B级:0,020毫米至1,600毫米（含1,600毫米）。IEC 60317第4条规定了标称导体直径-0-1:2013.这第二版取消并取代了1992年出版的第一版，修正案1:19 97和修正案2:19 99。本版构成技术修订版。与上一版相比，此版本包括以下重大技术变更: -新的3.2.2载有关于绕组线的一般说明，以前是范围的一部分； -修订IEC 60317-0-1:20 13的参考文献，以阐明其应用是规范性的； -合并17.1和17.2的可焊性要求； -新订的第23条，针孔测试。 关键词:可焊漆包圆铜绕组线要求，180级，双涂层

IEC 60317-36:2013+AMD1:2019+AMD2:2024 CSV specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin.
NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this part is:
- Grade 1B: 0,020 mm up to and including 1,600 mm;
- Grade 2B: 0,020 mm up to and including 1,600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 1992, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- new 3.2.2 containing general notes on winding wire, formerly a part of the scope;
- revision to references to IEC 60317-0-1:2013 to clarify that their application is normative;
- consolidation of 17.1 and 17.2 of the solderability requirements;
- new Clause 23, Pin hole test.

Keywords: requirements of solderable enamelled round copper winding wire, class 180, dual coating