General rules of prepreg for multilayer printed wiring boards
多层印制线路板用预浸料通则

1993-01-01

Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth
多层印制线路板用预浸料环氧树脂浸渍玻璃布

1996-01-01

다층 프린트 배선판용 프리프레그 (유리천 바탕재 에폭시 수지)
预浸料多层印刷线路板（环氧树脂浸渍玻璃布）

1997-08-19

다층 프린트 배선판용 프리프레그 (유리천 바탕재 에폭시 수지)
多层印刷线路板用预浸料（环氧树脂浸渍玻璃布）

1997-08-19

Prepreg for multilayer printed wiring boards -- Modified or unmodified polyimide resin-impregnated glass cloth
多层印制线路板用预浸料改性或未改性聚酰亚胺树脂浸渍玻璃布

1995-01-01

Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-Impregnated glass Cloth
多层印制线路板用预浸料双马来酰亚胺/三嗪/环氧树脂浸渍玻璃布

1995-01-01

航天用多层印制电路板试验方法
Test method of multilayer printed board for aerospace

2011-07-19

多层印制板用粘结片试验方法
Test methods for bongding sheet for multilayer printed boards

2016-10-13

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 多层印制板制造中用作粘合片材料的预浸料规范

1990-02-28

Printed wiring boards-Methods of test
印刷线路板 试验方法

1991-06-28

Test methods for printed wiring boards
印制线路板的试验方法

1993-01-01

Test methods for flexible printed wiring boards
挠性印制线路板的试验方法

1994-01-01

Materials for printed boards and other interconnecting structures-Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
印制板和其他互连结构用材料

2009-10-31

Test methods of copper-clad laminates for printed wiring boards
印制线路板用覆铜层压板的试验方法

1996-01-01

Materials for printed boards and other interconnecting structures-Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
印制板和其他互连结构用材料

2009-10-31

Materials for printed boards and other interconnecting structures-Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
印制板和其他互连结构用材料

2009-10-31

Materials for printed boards and other interconnecting structures-Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
印制板和其他互连结构用材料

2009-10-31

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
印刷板和其他互连结构材料 - 第4-14部分:预浸料材料（用于制造多层板材）的环氧树脂编织的E玻璃预浸料（垂直燃烧试验）用于无铅装配

2009-05-26

인쇄회로기판 및 기타 전자배선용 재료－제4-14부：(다층기판용) 프리프레그 소재에 대한 표준－에폭시 수지로 구성되며 (수직연소시험에서) 규정된 난연등급의 무연공정용 직조 E-유리섬유강화 프리프레그
印制板和其他互连结构用材料第4-14部分:非包覆预浸料分规范（多层板制造用）无铅装配用规定可燃性的环氧编织E玻璃预浸料（垂直燃烧试验）

2011-07-28

인쇄회로기판 및 기타 전자배선용 재료－제4-14부：(다층기판용) 프리프레그 소재에 대한 표준－에폭시 수지로 구성되며 (수직연소시험에서) 규정된 난연등급의 무연공정용 직조 E-유리섬유강화 프리프레그
印制板和其他互连结构用材料第4-14部分:未包覆预浸料分规范集（用于制造多层板）－无铅组装用规定可燃性的环氧编织E-玻璃预浸料（垂直燃烧试验）

2011-07-28