Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 61189-5-1:2016
电气材料、印制板和其他互连结构和组件的试验方法.第5-1部分:材料和组件的一般试验方法.印制板组件指南（IEC 61189-5-1-2016）；德文版EN 61189-5-1:2016

2017-04-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (IEC 61189-5-504:2020); German version EN IEC 61189-5-504:2020
电气材料、印制板和其他互连结构和组件的试验方法.第5-504部分:材料和组件的一般试验方法.过程离子污染试验（PICT）（IEC 61189-5-504-2020）；德国版本EN IEC 61189-5-504:2020

2021-09-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021); German version EN IEC 61189-5-502:2021
电气材料、印制板和其他互连结构和组件的试验方法.第5-502部分:材料和组件的一般试验方法.组件的表面绝缘电阻（SIR）试验（IEC 61189-5-502:2021）；德国版本EN IEC 61189-5-502:2021

2022-05-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015); German version EN 61189-5-2:2015
电气材料、印制板和其他互连结构和组件的试验方法.第5-2部分:材料和组件的一般试验方法.印制板组件的助焊剂（IEC 61189-5-2-2015）；德文版EN 61189-5-2:2015

2015-11-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN 61189-5-3:2015
电气材料、印制板和其他互连结构和组件的试验方法.第5-3部分:材料和组件的一般试验方法.印制板组件用焊膏（IEC 61189-5-3-2015）；德文版EN 61189-5-3:2015

2015-11-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017); German version EN 61189-5-503:2017
电气材料、印制板和其他互连结构和组件的试验方法——第5-503部分:材料和组件的通用试验方法——电路板的导电阳极丝（CAF）试验（IEC 61189-5-503-2017）；德文版EN 61189-5-503:2017

2018-01-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 61189-1:1997 + A1:2001); German version EN 61189-1:1997 + A1:2001
电气材料、印制板和其他互连结构和组件的试验方法.第1部分:一般试验方法和方法（IEC 61189-1-1997+A1-2001）；德文版EN 61189-1:1997+A1:2001

2002-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015
电气材料、印制板和其他互连结构和组件的试验方法.第5-4部分:材料和组件的一般试验方法.印制板组件用焊料合金、熔剂和非熔剂实心线（IEC 61189-5-4-2015）；德文版EN 61189-5-4:

2015-11-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
电气材料的试验方法 印制板和其他互连结构及组件.第5-506部分:材料和组件的一般试验方法.根据IEC 61189-5-501 使用细间距试验结构进行焊剂表面绝缘电阻（SIR）试验的相互比较评估

2019-06-26

Insulating and sheathing materials of electric and optical cables - Common test methods - Part 5-1: Methods specific to filling compounds - Drop point - Separation of oil - Lower temperature brittleness - Total acid number - Absence of corrosive components - Permittivity at 23 °C - D.C. resistivity at 23 °C and 100 °C (IEC 60811-5-1:1990, modified + A1:2003); German version EN 60811-5-1:1999 + A1:2004
电缆和光缆的绝缘和护套材料.通用试验方法.第5-1部分:填充化合物专用方法.滴点.油分离.低温脆性.总酸值.无腐蚀成分.23°C下的介电常数.直流电阻率

2004-12-01