IEC 62148的本部分涵盖了使用硅细间距球栅阵列（S-FBGA）和硅细间距地栅阵列（S-FLGA）的光子集成电路（PIC）封装的电气接口设计指南。在本文件中，S-FBGA封装的电气接口是信息性的。 本文件的目的是充分规定由光学发射器和接收器组成的PIC封装的电气接口，以实现PIC封装的机械和电气互换性。购买本文件时可获得的所有当前修订均包含在购买本文件中。

This part of IEC 62148 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.All current amendments available at time of purchase are included with the purchase of this document.