确定有助于使用热数据和模型模拟热行为和验证电子系统正确功能所需的信息，包括裸半导体管芯（带或不带连接结构）和/或最小封装半导体管芯。旨在协助所有参与模具设备供应链的人员遵守IEC 62258-1和IEC 62258-2的要求

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2