BLANK DETAIL SPECIFICATION FOR BURN-IN SOCKETS FOR CHIP CARRIER PACKAGES WITH MOLDED CARRIER RINGS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用模制载体环芯片载体封装用老化插座空白详细规范

2001-04-06

Sockets - Detail Specifications for Chip Carriers and Electronic Equipment
插座.芯片载体和电子设备的详细规范

BLANK DETAIL SPECIFICATION FOR CHIP CARRIER SOCKETS FOR LEADLESS TYPE A, B OR D CHIP CARRIERS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用无铅A、B或D型芯片托架用芯片托架插座空白详细规范

1997-11-06

BLANK DETAIL SPECIFICATION FOR CHIP CARRIER SOCKETS FOR PLASTIC CHIP CARRIER (PCC) PACKAGES WITH "J" TYPE LEADS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用带“J”型引线的塑料芯片载体（PCC）封装芯片载体插座空白详细规范

1997-11-06

DETAIL SPECIFICATION FOR SHIP CARRIER SOCKETS FOR LEADLESS TYPE A (1.27 MM (.050") SPACING) CHIP CARRIERS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用无铅A型（间距1.27 MM（.050”）芯片托架用船用托架插座详细规范

1998-03-12

BLANK DETAIL SPECIFICATION FOR CHIP CARRIER SOCKETS FOR PLASTIC QUAD FLAT PACKAGES FOR USE IN ELECTRONIC EQUIPMENT
电子设备用塑料方形扁平封装芯片载体插座空白详细规范

1997-11-06

DETAIL SPECIFICATION FOR CHIP CARRIER SOCKETS FOR PLASTIC QUAD FLAT PACK 0.635 MM (.025") LEAD SPACING (GULLWING)
0.635mm（.025”）引线间距（鸥翼）的塑料四方扁平封装芯片托架插座详细规范

1997-11-06