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现行 EIA 540 Series
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Sockets - Detail Specifications for Chip Carriers and Electronic Equipment 插座.芯片载体和电子设备的详细规范
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发布单位或类别: 美国-电子工业联合会
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研制信息
相似标准/计划/法规
现行
ECA/EIA 540AA00
BLANK DETAIL SPECIFICATION FOR CHIP CARRIER SOCKETS FOR LEADLESS TYPE A, B OR D CHIP CARRIERS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用无铅A、B或D型芯片托架用芯片托架插座空白详细规范
1997-11-06
现行
ECA/EIA 540GAAA
DETAIL SPECIFICATION FOR BURN-IN SOCKETS FOR CHIP CARRIER PACKAGESWITH MOLDED CARRIER RINGS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用模制载体环芯片载体包装用老化插座详细规范
2001-04-06
现行
ECA/EIA 540GA00
BLANK DETAIL SPECIFICATION FOR BURN-IN SOCKETS FOR CHIP CARRIER PACKAGES WITH MOLDED CARRIER RINGS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用模制载体环芯片载体封装用老化插座空白详细规范
2001-04-06
现行
ECA/EIA 540AC00
BLANK DETAIL SPECIFICATION FOR CHIP CARRIER SOCKETS FOR PLASTIC CHIP CARRIER (PCC) PACKAGES WITH "J" TYPE LEADS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用带“J”型引线的塑料芯片载体(PCC)封装芯片载体插座空白详细规范
1997-11-06
现行
ECA/EIA 540AB00
BLANK DETAIL SPECIFICATION FOR CHIP CARRIER SOCKETS FOR PLASTIC QUAD FLAT PACKAGES FOR USE IN ELECTRONIC EQUIPMENT
电子设备用塑料方形扁平封装芯片载体插座空白详细规范
1997-11-06
现行
ECA/EIA 540AAAA
DETAIL SPECIFICATION FOR SHIP CARRIER SOCKETS FOR LEADLESS TYPE A (1.27 MM (.050") SPACING) CHIP CARRIERS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用无铅A型(间距1.27 MM(.050”)芯片托架用船用托架插座详细规范
1998-03-12
现行
ECA/EIA 540A000
SECTIONAL FOR SOCKETS FOR CHIP CARRIERS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用芯片载体插座分规范
1997-11-06
现行
ECA/EIA 540DAAB
DETAIL SPECIFICATION FLEXIBLE CARRIER 2 PIECE DUAL IN-LINE SOCKET FOR USE IN ELECTRONIC EQUIPMENT
电子设备用挠性托架2件式双列直插式插座详细规范
1997-11-06
现行
ECA/EIA 540BAAC
DETAIL SPECIFICATION NONMECHANICALLY ACTUATED FLEXIBLE CARRIER SOCKETS FOR PIN GRID ARRAY FOR USE IN ELECTRONIC EQUIPMENT
电子设备用针栅阵列用非机械驱动柔性载体插座详细规范
1997-11-06
现行
ECA/EIA 540AD00
BLANK DETAIL SPECIFICATION FOR ADAPTOR - CARRIER QUAD FLAT PACK TO PIN GRID ARRAY SOCKETS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用转接器四芯扁平封装到引脚栅极阵列插座空白详细规范
1997-11-06
现行
ECA/EIA 540ABAA
DETAIL SPECIFICATION FOR CHIP CARRIER SOCKETS FOR PLASTIC QUAD FLAT PACK 0.635 MM (.025") LEAD SPACING (GULLWING)
0.635mm(.025”)引线间距(鸥翼)的塑料四方扁平封装芯片托架插座详细规范
1997-11-06
现行
ECA/EIA 540DA00
BLANK DETAIL SPECIFICATION FOR DUAL IN-LINE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用双列直插式插座空白详细规范
1997-11-06
现行
ECA/EIA 540FA00
BLANK DETAIL SPECIFICATION FOR MULTI-PACKAGE MODULE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用多封装模块插座空白详细规范
1997-11-06
现行
ECA/EIA 540DAAA
DETAIL SPECIFICATION FOR DUAL IN-LINE 2 PIECE CONTACT SOCKET FOR USE IN ELECTRONIC EQUIPMENT
电子设备用双列直插式2件式接触插座详细规范
1994-11-01
现行
ECA/EIA 540DBAA
DETAIL SPECIFICATION FOR DECOUPLING CAPACITOR DUAL-IN LINE PACKAGE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用去耦电容器双列直插式封装插座详细规范
1999-05-12
现行
ECA/EIA 540B0AE
DETAIL SPECIFICATION FOR PRODUCTION LAND GRID ARRAY (LGA) SOCKET FOR USE IN ELECTRONIC EQUIPMENT
电子设备用生产接地网阵列(LGA)插座详细规范
2000-06-01
现行
SJ/T 11482-2014
电子设备用压敏电阻器 MYP型片式压敏电阻器详细规范 评定水平E
Varistors for use in electronic equipment - Detail specification for chip varistors of type MYP-Assessment level E
2014-10-14
现行
EIA SP3643
Detail Specification for Burn-in Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment
电子设备用球栅阵列器件用老化插座详细规范
1997-11-05
现行
ECA/EIA 540HAAA
DETAIL SPECIFICATION FOR BURN-IN SOCKETS USED WITH BALL GRID ARRAY DEVICES FOR USE IN ELECTRONIC EQUIPMENT
电子设备用球栅阵列器件用老化插座详细规范
2000-06-01
现行
SJ/T 11278.4.1-2014
电子设备用压敏电阻器 第4部分:空白详细规范 片式压敏电阻器 评定水平E
Varistors for use in electronic equipment - Part 4:Blank detail specification for chip varistors - Assessment level E
2014-10-14