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Plating, Tin 镀锡
发布日期: 2019-01-14
本规范涵盖了金属上电沉积锡的要求和镀层的性能。该工艺通常用于防止金属表面磨损或卡住,提供软钎焊表面,或提高耐腐蚀性,但其用途不限于此类应用(见8.6)。
This specification covers the requirements for electrodeposition of tin on metals and the properties of the deposit. This process has been used typically to prevent galling or seizing of metal surfaces, to provide a surface for soft soldering, or to improve corrosion resistance, but usage is not limited to such applications (See 8.6).
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