现行

ASTM B579-22

Standard Specification for Electrodeposited Coatings of Tin-Lead Alloy (Solder Plate)
锡铅合金电沉积涂层（焊锡板）的标准规范

2022-05-01

现行

MIL MIL-P-81728A Notice 1-Cancellation

PLATING, TIN LEAD (ELECTRODEPOSITED (SUPERSEDING MIL-P-81728) (S/S BY SAE-AMS-P-81728)
锡铅镀层（电沉积的（取代MIL-P-81728）（由SAE-AMS-P-81728制成）

1998-06-26

现行

MIL MIL-P-81728A

PLATING, TIN LEAD (ELECTRODEPOSITED (SUPERSEDING MIL-P-81728) (S/S BY SAE-AMS-P-81728)
锡铅电镀（电沉积（取代MIL-P-81728）（由SAE-AMS-P-81728提供）

1973-02-13

现行

ASTM B200-22

Standard Specification for Electrodeposited Coatings of Lead and Lead-Tin Alloys on Steel and Ferrous Alloys
钢和铁合金上铅和铅锡合金电沉积涂层的标准规范

2022-11-15

现行

MIL MIL-P-23408B Notice 2-Inactivation

PLATING: TIN-CADMIUM (ELECTRODEPOSITED) (SUPERSEDING MIL-P-23408A)
镀层:锡-镉（电沉积）（取代MIL-P-23408A）

1997-09-30

现行

MIL MIL-P-23408B Notice 1-Validation

PLATING: TIN-CADMIUM (ELECTRODEPOSITED) (SUPERSEDING MIL-P-23408A)
镀层:锡-镉（电沉积）（取代MIL-P-23408A）

1991-10-28

现行

MIL MIL-P-23408B

PLATING: TIN-CADMIUM (ELECTRODEPOSITED) (SUPERSEDING MIL-P-23408A)
电镀:锡镉（电沉积）（取代MIL-P-23408A）

1983-08-23

现行

MIL MIL-L-13808B Notice 1-Validation

LEAD PLATING (ELECTRODEPOSITED) (SUPERSEDING MIL-L-13808A)
铅镀层（电沉积）（取代MIL-L-13808A）

1988-03-30

现行

MIL MIL-L-13808B

LEAD PLATING (ELECTRODEPOSITED) (SUPERSEDING MIL-L-13808A)
镀铅（电沉积）（取代MIL-L-13808A）

1975-02-14

现行

BS 3338-15-1965

Methods for the sampling and analysis of tin and tin alloys-Method for the determination of copper and lead in white metal bearing alloys (electrodeposition method)
锡及锡合金的取样和分析方法

1965-03-18

现行

SJ/Z 1095-1976

镀铅锡合金溶液典型分析方法
Typical methods for the analysis of lead-tin alloy plating solution

1976-09-02

现行

MIL MIL-L-46064A Notice 2-Cancellation

LEAD-TIN ALLOY COATING (ELECTRODEPOSITED) (SUPERSEDING MIL-L-46064) (S/S BY ASTM-B200-1985(R93)E1)
铅锡合金镀层（电沉积）（取代MIL-L-46064）（S/S由ASTM-B200-1985（R93）E1提供）

1998-04-07

现行

MIL MIL-L-46064A Notice 1-Validation

LEAD-TIN ALLOY COATING (ELECTRODEPOSITED) (SUPERSEDING MIL-L-46064) (S/S BY ASTM-B200-1985(R93)E1)
铅锡合金镀层（电沉积）（取代MIL-L-46064）（S/S由ASTM-B200-1985（R93）E1提供）

1989-07-31

现行

MIL MIL-L-46064A

LEAD-TIN ALLOY COATING (ELECTRODEPOSITED) (SUPERSEDING MIL-L-46064) (S/S BY ASTM-B200-1985(R93)E1)
铅锡合金镀层（电沉积）（取代MIL-L-46064）（根据ASTM-B200-1985（R93）E1标准S/S）

1983-08-31

现行

HB/Z 5094.3-2004

酸性电镀锡溶液分析方法 第3部分:原子吸收光谱法测定铅的含量
Methods for analysis of acid plating tin solutions-Part 3:Determination of lead content by atomic absorption spectrometric method

2004-02-16

现行

MIL MIL-T-10727C Notice 1-Cancellation

TIN PLATING: ELECTRODEPOSITED OR HOT-DIPPED, FOR FERROUS AND NONFERROUS METALS (SUPERSEDING MIL-T-10727B) (S/S BY ASTM-B545-1997 AND ASTM-B339-1995)
镀锡:电沉积或热浸镀 用于黑色金属和有色金属（取代MIL-T-10727B）（由ASTM-B545-1997和ASTM-B339-1995提供）

1997-02-07

现行

SAE AS83519/7

SHIELD TERMINATION, SOLDER STYLE, INSULATED, HEAT-SHRINKABLE, ENVIRONMENT RESISTANT WITH PRE INSTALLED LEADS FOR CABLES HAVING TIN OR SILVER PLATED SHIELDS (CLASS I)
具有镀锡或镀银屏蔽（I级）的电缆用预安装导线的绝缘、热缩、耐环境的焊接式屏蔽终端

2022-07-13

现行

SAE AS83519/2A

SHIELD TERMINATION, SOLDER STYLE, INSULATED, HEAT-SHRINKABLE, ENVIRONMENT RESISTANT WITH PRE INSTALLED LEADS FOR CABLES HAVING TIN OR SILVER PLATED SHIELDS (CLASS I)
具有镀锡或镀银屏蔽（I级）的电缆用预安装导线的绝缘、热缩、耐环境的焊接式屏蔽终端

2016-04-13

现行

MIL MIL-S-83519/2B Notice 2-Cancellation

SHIELD TERMINATION, SOLDER STYLE, INSULATED, HEAT-SHRINKABLE, ENVIRONMENT RESISTANT WITH PRE INSTALLED LEADS FOR CABLES HAVING TIN OR SILVER PLATED SHIELDS (CLASS I) (SUPERSEDING MIL-S-83519/2A) (S/S BY SAE-AS83519/2)
具有镀锡或镀银屏蔽（I类）（取代MIL-S-83519/2A）的焊接式绝缘、热缩、耐环境屏蔽终端 带预装引线（由SAE-AS83519/2代替）

2000-10-26

现行

MIL MIL-S-83519/2B

SHIELD TERMINATION, SOLDER STYLE, INSULATED, HEAT-SHRINKABLE, ENVIRONMENT RESISTANT WITH PRE INSTALLED LEADS FOR CABLES HAVING TIN OR SILVER PLATED SHIELDS (CLASS I) (SUPERSEDING MIL-S-83519/2A) (S/S BY SAE-AS83519/2)
具有镀锡或镀银屏蔽（I级）的电缆用预安装引线的绝缘、热缩、耐环境的焊接式屏蔽终端（取代MIL-S-83519/2A）（由SAE-AS83519/2提供）

1995-08-04