MIL MIL-P-81728A-锡铅电镀（电沉积（取代MIL-P-81728）（由SAE-AMS-P-81728提供）-国家数字标准馆

现行

MIL MIL-P-81728A Notice 1-Cancellation

PLATING, TIN LEAD (ELECTRODEPOSITED (SUPERSEDING MIL-P-81728) (S/S BY SAE-AMS-P-81728)
锡铅镀层（电沉积的（取代MIL-P-81728）（由SAE-AMS-P-81728制成）

1998-06-26

现行

MIL MIL-P-45209B Notice 1-Validation

PALLADIUM PLATING, (ELECTRODEPOSITED) (SUPERSEDING MIL-P-45209A) (S/S BY ASTM-B679-1998)
（电沉积）（取代MIL-P-45209A）（按ASTM-B679-1998的S/S）

1987-02-10

现行

MIL MIL-P-45209B Notice 2-Cancellation

PALLADIUM PLATING, (ELECTRODEPOSITED) (SUPERSEDING MIL-P-45209A) (S/S BY ASTM-B679-1998)
钯镀层（电沉积）（取代MIL-P-45209A）

1998-04-07

现行

MIL MIL-L-46064A Notice 2-Cancellation

LEAD-TIN ALLOY COATING (ELECTRODEPOSITED) (SUPERSEDING MIL-L-46064) (S/S BY ASTM-B200-1985(R93)E1)
铅锡合金镀层（电沉积）（取代MIL-L-46064）（S/S由ASTM-B200-1985（R93）E1提供）

1998-04-07

现行

MIL MIL-L-46064A Notice 1-Validation

LEAD-TIN ALLOY COATING (ELECTRODEPOSITED) (SUPERSEDING MIL-L-46064) (S/S BY ASTM-B200-1985(R93)E1)
铅锡合金镀层（电沉积）（取代MIL-L-46064）（S/S由ASTM-B200-1985（R93）E1提供）

1989-07-31

现行

MIL MIL-L-46064A

LEAD-TIN ALLOY COATING (ELECTRODEPOSITED) (SUPERSEDING MIL-L-46064) (S/S BY ASTM-B200-1985(R93)E1)
铅锡合金镀层（电沉积）（取代MIL-L-46064）（根据ASTM-B200-1985（R93）E1标准S/S）

1983-08-31

现行

MIL MIL-P-47184A Notice 1-Cancellation

PLATING, NICKEL-TUNGSTEN, ELECTRODEPOSIT ON ALUMINUM ALLOYS, BY SELECTIVE (BRUSH) METHOD (NO S/S DOCUMENT) (SUPERSEDING MIL-P-47184)
用选择性（刷）法在铝合金上电沉积镍钨镀层（无S/S文件）（代替MIL-P-47184）

1995-11-03

现行

MIL MIL-P-47184A

PLATING, NICKEL-TUNGSTEN, ELECTRODEPOSIT ON ALUMINUM ALLOYS, BY SELECTIVE (BRUSH) METHOD (NO S/S DOCUMENT) (SUPERSEDING MIL-P-47184)
用选择性（刷）法在铝合金上电沉积镍钨镀层（无S/S文件）（代替MIL-P-47184）

1990-12-12

现行

FED QQ-N-290A

NICKEL PLATING (ELECTRODEPOSITED) (SUPERSEDING QQ-N-290 AND MIL-P-6859) (S/S BY SAE-AMS-QQ-N-290)
镀镍（电沉积）（取代QQ-N-290和MIL-P-6859）（S/S由SAE-AMS-QQ-N-290提供）

1971-11-12

现行

FED QQ-N-290A

NICKEL PLATING (ELECTRODEPOSITED) (SUPERSEDING QQ-N-290 AND MIL-P-6859) (S/S BY SAE-AMS-QQ-N-290)
镀镍（电沉积）（取代QQ-N-290和MIL-P-6859）（S/S由SAE-AMS-QQ-N-290提供）

1971-11-12

现行

MIL MIL-T-10727C Notice 1-Cancellation

TIN PLATING: ELECTRODEPOSITED OR HOT-DIPPED, FOR FERROUS AND NONFERROUS METALS (SUPERSEDING MIL-T-10727B) (S/S BY ASTM-B545-1997 AND ASTM-B339-1995)
镀锡:电沉积或热浸镀用于黑色金属和有色金属（取代MIL-T-10727B）（由ASTM-B545-1997和ASTM-B339-1995提供）

1997-02-07

现行

MIL MIL-S-83519/2B Notice 2-Cancellation

SHIELD TERMINATION, SOLDER STYLE, INSULATED, HEAT-SHRINKABLE, ENVIRONMENT RESISTANT WITH PRE INSTALLED LEADS FOR CABLES HAVING TIN OR SILVER PLATED SHIELDS (CLASS I) (SUPERSEDING MIL-S-83519/2A) (S/S BY SAE-AS83519/2)
具有镀锡或镀银屏蔽（I类）（取代MIL-S-83519/2A）的焊接式绝缘、热缩、耐环境屏蔽终端带预装引线（由SAE-AS83519/2代替）

2000-10-26

现行

MIL MIL-S-83519/2B

SHIELD TERMINATION, SOLDER STYLE, INSULATED, HEAT-SHRINKABLE, ENVIRONMENT RESISTANT WITH PRE INSTALLED LEADS FOR CABLES HAVING TIN OR SILVER PLATED SHIELDS (CLASS I) (SUPERSEDING MIL-S-83519/2A) (S/S BY SAE-AS83519/2)
具有镀锡或镀银屏蔽（I级）的电缆用预安装引线的绝缘、热缩、耐环境的焊接式屏蔽终端（取代MIL-S-83519/2A）（由SAE-AS83519/2提供）

1995-08-04