IEC 62148-21:2021 RLV包含官方IEC国际标准及其红线版本。红线版本仅提供英文版本，为您提供了一种快速简便的方法来比较IEC官方标准与其前一版本之间的所有变化。 IEC 62148-21:2021涵盖了使用硅细间距球栅阵列（S-FBGA）和硅细间距陆栅阵列（S-FLGA）的光子集成电路（PIC）封装的电气接口设计指南。在本文件中，S-FBGA包的电气接口仅供参考。本文件的目的是充分规定由光学发射器和接收器组成的PIC封装的电气接口，以实现PIC封装的机械和电气互换性。 第二版取消并取代了2019年出版的第一版。本版本为技术修订版。与前一版本相比，本版本包括以下重大技术更改:光学终端区域周围的电气保护带区域的规范，以便允许以更高符号率（例如50 Gbaud和100 Gbaud）使用电信号的应用。

IEC 62148-21:2021 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62148-21: 2021 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. This second edition cancels and replaces the first edition published in 2019. This edition constitutes a technical revision. This edition includes the following significant technical change with respect to the previous edition: specification of an electric guard band area around the optical terminal area, so as to allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud).