IEC/TR 62258-4:20 12旨在促进半导体管芯产品的生产、供应和使用，包括: -晶片； -单个裸管芯； -具有附接的连接结构的管芯和晶片； -最小或部分封装的管芯和晶片。 本技术报告包含一份调查问卷，基于IEC 62258其他部分的要求，可用于裸片器件供应商和采购商之间的谈判和合同。它旨在帮助模具设备供应链中的所有相关人员遵守IEC 62258-1:20 09和IEC 62258-2:20 11标准的要求。应认识到，本技术报告中包含的表格构成了可能提供的信息清单，可能不相关或不可能填写所有字段。不同的市场可能需要本文所要求的信息的不同子集。 与上一版相比，此版本包括以下重大技术变更:文件清单已更改，以准确反映IEC 62258-1:20 09要求。

IEC/TR 62258-4:2012 has been developed to facilitate the production, supply and use of semiconductor die products, including:
- wafers;
- singulated bare die;
- die and wafers with attached connection structures;
- minimally or partially encapsulated die and wafers.
This technical report contains a questionnaire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1:2009 and IEC 62258-2:2011 standards. It should be recognized that the tables contained in this technical report form a checklist of information that can potentially be supplied and that it may not be relevant or possible to complete all fields. Different markets may require different subsets of the information requested herein. This edition includes the following significant technical changes with respect to the previous edition: The document checklist was changed to mirror IEC 62258-1:2009 requirements exactly.