一份针对辐射硬度保证（RHA）多芯片模块（MCM）和混合微电路供应商和用户的修订和扩展出版物现已面世。JEP133的A版包括对引言的修改、对定义的澄清以及对文件中几个技术问题的澄清。此外，书目部分也进行了更新，增加了参考文献。鉴于成分骰子的硬度保证水平不同，本文件提供了如何实现、维持和确保所需辐射硬度水平的指南。它还描述了如何处理MCM/混合开发人员、采购活动或用户将遇到的各种辐射硬度情况。本指南旨在补充三个相关性能规范:MIL-PRF-38534、MIL-PRF-38535和MIL-PRF-19500。

A revised and expanded publication for suppliers and users of radiation hardness assured (RHA) multichip modules (MCMs) and hybrid microcircuits, is now available. Revision A of JEP133 includes modifications to the introduction, clarification of a definition and clarification of several technical issues within the document. In addition, the Bibliography section was updated to include added references. The document provides guidance as to how to achieve, maintain and ensure required levels of radiation-hardness given the fact that the constituent dice can have different levels of hardness assurance. It also describes how to deal with the various radiation hardness situations that an MCM/Hybrid developer, procuring activity or user will encounter. The guide is intended to supplement three relevant performance specifications: MIL-PRF-38534, MIL-PRF-38535 and MIL-PRF-19500.