首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
被代替 GB/T 5593-1996
到馆阅读
收藏跟踪
购买正版
电子元器件结构陶瓷材料 Structure ceramic materials used in electronic components
发布日期: 1996-09-09
实施日期: 1997-05-01
废止日期: 2016-01-01
分类信息
关联关系
研制信息
相似标准/计划/法规
现行
GB/T 5593-2015
电子元器件结构陶瓷材料
Structure ceramic materials used in electronic component and device
2015-05-15
现行
SJ/T 10760-1996
电子元器件结构陶瓷材料的名称和牌号的命名方法
Designations for names and models of structure ceramic materials for electronic components
1996-11-20
现行
GB/T 5594.1-1985
电子元器件结构陶瓷材料性能测试方法 气密性测试方法
Test methods for properties of structure ceramic used in electronic components--Test method for gas-tightness
1985-11-27
现行
GB/T 5594.5-1985
电子元器件结构陶瓷材料性能测试方法 体积电阻率测试方法
Test methods for properties of structure ceramic used in electronic components--Test method forvolume resistivity
1985-11-27
现行
BS 4789-1972
Specification for ceramic components for use in envelopes for electronic tubes
电子管外壳用陶瓷元件规范
1972-03-30
现行
GB/T 5594.8-2015
电子元器件结构陶瓷材料性能测试方法 第8部分:显微结构的测定方法
Test methods for properties of structure ceramic used in electronic components and device—Part 8: Test method for microstructure
2015-05-15
现行
GB/T 5594.7-2015
电子元器件结构陶瓷材料性能测试方法 第7部分:透液性测定方法
Test methods for properties of structure ceramic used in electronic components and device—Part 7: Test method for liquid permeability
2015-05-15
现行
GB/T 5594.2-1985
电子元器件结构陶瓷材料性能测试方法 杨氏弹性模量、泊松比测试方法
Test methods for properties of structure ceramic used in electronic components--Test method for Youngs elastic modulus and Poisson ratio
1985-11-27
现行
SJ 3262-1989
电子元件包封材料通用技术条件
General specification for packaging materials for use in electronic components
1989-03-20
现行
SJ/T 11125-1997
电子元器件用环氧系灌封材料
Encapsulation materials of epoxy series for use in electronic components
1997-09-03
现行
SJ/T 11126-1997
电子元件用酚醛系包封材料
Encapsulation materials of phenolic series for use in electronic components
1997-09-02
现行
GB/T 5594.3-2015
电子元器件结构陶瓷材料性能测试方法 第3部分:平均线膨胀系数测试方法
Test methods for properties of structure ceramic used in electronic components and device—Part 3: Test method for mean coefficient of linear expansion
2015-05-15
现行
SJ/T 11124-1997
电子元器件用环氧系粉末包封材料
Encapsulation materials of expoy series powder for use in electronic components
1997-09-02
现行
GB/T 5594.4-2015
电子元器件结构陶瓷材料性能测试方法 第4部分:介电常数和介质损耗角正切值的测试方法
Test methods for properties of structure ceramic used in electronic components and device—Part 4: Test method for permittivity and dielectric loss angle tangent value
2015-05-15
现行
GB/T 5594.6-2015
电子元器件结构陶瓷材料性能测试方法 第6部分:化学稳定性测试方法
Test methods for properties of structure ceramics used in eletronic components and device—Part 6: Test method for chemical durability
2015-05-15
现行
BS EN 61189-6-2006
Test methods for electrical materials, interconnection structures and assemblies-Test methods for materials used in manufacturing electronic assemblies
电气材料、互连结构和组件的试验方法
2006-09-29
现行
GB/T 17190-1997
电子设备用压电陶瓷滤波器 电子元器件质量评定体系规范 第1部分:总规范 鉴定批准
Piezoelectric ceramic filters for use in electronic equipment A specification in the quality assessment system for electronic components—Part 1:Generic specification—Qualification approval
1997-12-26
现行
GB/T 12864-1997
电子设备用压电陶瓷滤波器 电子元器件质量评定体系规范 第2部分:分规范 鉴定批准
Piezoelectric ceramic filters for use in electronic equipment A specification in the quality assessment system for electronic components Part 2:Sectional specification—Qualification approval
1997-12-26
现行
KS C IEC 61261-1
전자장비용 압전 세라믹 필터 ― IEC 전자부품 품질인증 (IECQ) 규격 ― 제 1부: 품목 규격 ― 품질 인증
电子设备用压电陶瓷滤波器IEC电子元器件质量评定体系(IECQ)规范第1部分:总规范鉴定批准
2018-11-08
现行
KS C IEC 61261-2
전자장비용 압전 세라믹 필터 ― IEC 전자부품 품질인증 (IECQ) 규격 ― 제 2부: 품종 규격 ― 품질 인증
电子设备用压电陶瓷滤波器IEC电子元器件质量评定体系(IECQ)规范第2部分:分规范合格审定
2018-11-08