IPC-2226A，《高密度互连（HDI）印制板的分段设计标准》与IPC-2221B结合使用。IPC-2226A标准规定了高密度互连（HDI）印制板和微孔技术的设计要求和注意事项。修订版A对文件进行了实质性更新，对HDI建筑采用了全新的颜色，对布线密度系数进行了新的覆盖，并对特征尺寸建议进行了完整的重建，包括宽高比、捕获和目标土地尺寸。第3节、第5节和第9节中的几乎每一个图形都经过了修改和/或补充，添加了新的图形，以解决各种微孔形成过程和HDI结构。

IPC-2226A, Sectional Design Standards for High Density Interconnect (HDI) Printed Boards is used in conjunction with IPC-2221B. The IPC-2226A standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and microvia technology. Revision A constitutes a substantial update to the document, with an all new color key for HDI constructions, new coverage of routing density factors and a complete rebuild of feature size recommendations, including aspect ratio, capture and target land sizes. Almost every graphic in Sections 3, 5 and 9 has been revised and/or supplemented with new graphics addressing various microvia formation processes and HDI constructions.