首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 WRC 146
到馆提醒
收藏跟踪
购买正版
Structural Stability Design Provisions-A Comparison of the Provisions of the CRC Guide and the Specifications of AASHO, AISC and AREA 结构稳定性设计规定——CRC指南规定与AASHO、AISC和AREA规范的比较
以表格形式对立柱研究委员会“金属受压构件设计标准指南”的稳定性规定与美国国家公路官员协会、美国钢结构协会和美国铁路工程协会的规范进行了比较
A comparison is made in tabular form between the stability provisions of the Column Research Council "Guide to Design Criteria for Metal Compression Members" and the specifications of the American Association of State Highway Officials, the American Institute of Steel Construction, and the American Railway Engineering Association
分类信息
发布单位或类别: 未知国家-其他未分类
关联关系
研制信息
相似标准/计划/法规
现行
DIN 1052-10
Design of timber structures - Part 10: Additional provisions
木结构设计.第10部分:附加规定
2012-05-01
现行
BS EN 17371-2-2021
Provision of services-Services contracts. Guidance for the design, content and structure of contracts
提供服务
2021-11-18
现行
UNE-ENV 1998-5-1998
EUROCODE 8: DESIGN PROVISIONS FOR EARTHQUAKE RESISTANCE OF STRUCTURES. PART 5: FOUNDATIONS, RETAINING STRUCTURES AND GEOTECHNICAL ASPECTS.
欧洲规范8:结构抗震设计规定 第5部分:基础、挡土结构和岩土工程方面
1998-03-31
现行
UNE-ENV 1998-3-2000
EUROCODE 8. DESIGN PROVISIONS FOR EARTHQUAKE RESISTANCE OF STRUCTURES. PART 3: TOWERS, MASTS AND CHIMNEYS.
欧洲代码8 结构抗震设计规定 第3部分:塔、桅杆和烟囱
2000-12-31
现行
IEC TS 62454-2007
Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
电子设备的机械结构.设计指南:IEC 60297和IEC 60917系列机柜内电子设备水冷的接口尺寸和规定
2007-10-10
现行
BS DD IEC/TS 62454-2007
Mechanical structures for electronic equipment. Design guide. Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
电子设备的机械结构 设计指南 IEC 60297和IEC 60917系列机柜内电子设备的接口尺寸和水冷规定
2007-11-30
现行
BS DD IEC/TS 62610-1-2009
Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series-Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
电子设备的机械结构 按照IEC 60297和IEC 60917系列对机柜进行热管理 设计指南 热电冷却系统的接口尺寸和规定(珀耳帖效应)
2010-01-31
现行
IEC TS 62610-1-2009
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
电子设备的机械结构.符合IEC 60297和IEC 60917系列的机柜热管理.第1部分:设计指南:热电冷却系统的接口尺寸和规定(珀耳帖效应)
2009-09-16