IEC TS 62610-1:2009-电子设备的机械结构.符合IEC 60297和IEC 60917系列的机柜热管理.第1部分:设计指南:热电冷却系统的接口尺寸和规定（珀耳帖效应）-国家数字标准馆

现行 IEC TS 62610-1:2009

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Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect) 电子设备的机械结构.符合IEC 60297和IEC 60917系列的机柜热管理.第1部分:设计指南:热电冷却系统的接口尺寸和规定（珀耳帖效应）

发布日期： 2009-09-16

IEC/TS 62610-1:20 09（E）提供了在IEC 60297（19英寸）和IEC 60917（25毫米）系列机柜中安装热电冷却系统（珀尔帖效应）的指南。冷却性能与机柜内的安装位置直接相关。确定了三种典型的安装位置:
1)具有内部或外部安装的热电冷却系统的机柜，用于冷却整个机柜；
2)具有顶部安装的热电冷却系统的机柜，用于冷却整个机柜；
3)具有内置热电冷却系统的机柜，其形式为用于热点冷却的子机架。

IEC/TS 62610-1:2009(E) provides guidelines for the installation of thermoelectrical cooling systems (Peltier effect) within cabinets ofthe IEC 60297 (19 inch) and IEC 60917 (25 mm) series. The cooling performance is in direct relation with the mounting location within a cabinet. Three typical mounting locations are identified:

1) cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet;

2) cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet;

3) cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling.

分类信息

发布单位或类别：国际组织-国际电工委员会

ICS分类： 31.240电子学 - 电子设备用机械构件

关联关系

研制信息

归口单位： TC 48/SC 48D

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