IEC 60747-17:20 20规定了磁耦合器和电容耦合器的术语、基本额定值、特性、安全测试和测量方法。 它规定了基本绝缘和加强绝缘的磁性和电容耦合器的绝缘和隔离特性的原则和要求。 本第一版取消并取代IEC PAS 60747-17:20 11。本版构成技术修订版。 本版本包括以下与IEC PAS 60747-17:20 11相关的重大技术变更: a)引入寿命安全系数以改善寿命考虑，以符合广泛认可的二氧化硅(TDDB)和薄膜聚合物隔离层的老化机制； b）通过增加对过程、安全因素、生成数据点的方法和相应寿命插值的详细描述以及具体说明，显著改进了“寿命终止测试”段落和统计寿命考虑c所需样品的最小数量； c)引入相似性认证概念，包括附件A，就资格考虑和所需认证程序提供指导； d)允许浪涌脉冲测试的替代脉冲形状，以避免由于浪涌测试仪可用性引起的问题； e)贯穿标准的各种改进:定义，例如耦合器的类型已得到改进，浪涌脉冲VIMP等级的引入，玻璃化转变温度的使用，预处理已被重新定义，以提高可用性并与当今耦合器的设计和功能、可用的模制化合物等更好地兼容。

IEC 60747-17:2020 specifies the terminology, essential ratings, characteristics, safety test and the measuring methods of magnetic coupler and capacitive coupler.
It specifies the principles and requirements of insulation and isolation characteristics for magnetic and capacitive couplers for basic insulation and reinforced insulation.
This first edition cancels and replaces IEC PAS 60747-17:2011. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to IEC PAS 60747-17:2011:
a) introduced lifetime safety factors for improved life time consideration, to comply with widely recognized aging mechanisms of silicone dioxide (TDDB) and thin film polymer isolation layers;
b) significantly improved "end of life testing" paragraph and statistical life time consideration by adding detailed description on process, safety factors, methods of generating data points and respective lifetime interpolations as well as being specific on minimum amount of samples required;
c) introduced concept of certification by similarity, including Annex A, giving guidance on qualification considerations and required certification process;
d) alternative pulse shape allowed for surge pulse testing, to avoid issues due to surge tester availability;
e) various improvements throughout the standard: definitions, for example type of coupler have been improved, introduction of surge impulse VIMP rating, usage of glass transition temperature, pre-conditioning have been redefined for improved usability and better compatibility with today’s design and functionality of couplers, available mold compounds, etc.