建立机械跌落和冲击以及测试指南，用于从系统到组件级别评估印制板组件的焊点可靠性。本文件阐述了定义机械冲击使用条件的方法、定义与此类使用条件相关的系统级、系统印制板级和组件测试板级测试的方法，以及机械冲击测试中使用实验计量学的指南。

Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of experimental metrologies for mechanical shock tests.