印制电路和其他内连接结构用材料-第4-11部分:不覆铜的预浸料系列分规范—限定燃烧性的无卤E玻纤布增强环氧粘结片
Materials for printed boards and other interconnecting structures – Part 4-11: Sectional specification set for prepreg materials, unclad – Non-halogenated epoxide, woven E-glass prepreg of defined flammability