IPC-2223E与IPC-2221、IPC-2223一起使用，确定了柔性印制板设计的具体要求，以及组件安装和互连结构的形式。结构中使用的柔性材料由绝缘膜、增强和/或非增强电介质以及金属材料组成。IPC-2223E提供了新的设计指南和制造图纸要求、孔边间距、弯曲区域导体注意事项、刚性和柔性区域之间的介电厚度以及双排零插入力（ZIF）连接器。

IPC-2223E used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. IPC-2223E provides new design guidance and requirements for fabrication drawings, hole to edge spacing, bend area conductor considerations, dielectric thickness between rigid and flexible regions and dual row zero insertion force (ZIF) connectors.