现行

GB/T 31556.1-2015

包装袋　尺寸描述和测量方法　第1部分：纸袋
Packaging sacks—Description and method of measurement for dimension—Part 1: Paper sacks

2015-05-15

现行

BS EN 26591-1-1993

Packaging. Sacks. Description and method of measurement-Empty paper sacks
包装材料麻袋 描述和测量方法 空纸袋

1993-03-15

现行

ISO 6591-1-1984

Packaging — Sacks — Description and method of measurement — Part 1: Empty paper sacks
包装与包装；麻袋和麻袋；说明和测量方法第1部分:空纸袋

1984-08-01

现行

BS EN 26591-2-1993

Packaging. Sacks. Description and method of measurement-Empty sacks made from thermoplastic flexible film
包装材料麻袋 描述和测量方法 由热塑性柔性薄膜制成的空袋

1993-03-15

现行

KS T ISO 6591-2

포장 — 포대 — 표기 및 측정방법 —제2부: 플라스틱필름 포대
包装 - 袋 - 测量说明和方法 - 第2部分:由热塑性柔性薄膜制成的空袋

2020-08-07

现行

ISO 6591-2-1985

Packaging — Sacks — Description and method of measurement — Part 2: Empty sacks made from thermoplastic flexible film
包装与包装；麻袋和麻袋；说明和测量方法第2部分:热塑性柔性薄膜制成的空袋

1985-11-14

现行

UNE-EN 26591-1-1993

PACKAGING. SACKS. DESCRIPTION AND METHOD OF MEASUREMENT. PART 1: EMPTY PAPER SACKS. (ISO 6591-1:1984).
包装材料麻袋 描述和测量方法 第一部分:空纸袋 （ISO 6591-1-1984）

1993-11-23

现行

JIS Z 1531-1-2004

Kraft paper sacks -- Description and method of measurement
牛皮纸袋描述和测量方法

2004-01-01

现行

KS T ISO 6591-1

공지대의 치수 표기 및 측정 방법
描述和测量的方法 用于空纸袋

2020-12-31

现行

UNE-EN 26591-2-1995

PACKAGING. SACKS. DESCRIPTION AND METHOD OF MEASUREMENT. PART 2: EMPTY SACKS MADE FROM THERMOPLASTIC FLEXIBLE FILM. (ISO 6591-2:1985).
包装材料麻袋 描述和测量方法 第2部分:由热塑性柔性薄膜制成的空袋 （ISO 6591-2:1985）

1995-01-20

现行

DIN EN 26591-1

Packaging; sacks; description and method of measurement; part 1: empty paper sacks (ISO 6591-1:1984); german version EN 26591-1:1992
包装材料麻袋；描述和测量方法；第1部分:空纸袋（ISO 6591-1-1984）；德文版EN 26591-1:1992

1993-02-01

现行

DIN EN 26591-2

Packaging; sacks; description and method of measurement; part 2: empty sacks made from thermoplastic flexible film (ISO 6591-2:1985); german version EN 26591-2:1992
包装材料麻袋；描述和测量方法；第2部分:热塑性柔性薄膜制空袋（ISO 6591-2-1985）；德文版EN 26591-2:1992

1993-02-01

现行

BS EN 60191-6-21-2010

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化

2010-12-31

现行

BS EN 60191-6-20-2010

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化

2010-12-31

现行

IEC 60191-6-21-2010

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化第6-21部分:表面贴装半导体器件封装外形图的一般规则 - 小外形封装（sop）封装尺寸的测量方法

2010-08-30

现行

BS EN 60191-6-4-2003

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2003-08-04

现行

IEC 60191-6-20-2010

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化 - 第6-20部分:表面贴装半导体器件封装外形图的一般规则 - 小型J型引线封装（Soj）封装尺寸测量方法

2010-08-30

现行

IEC 60191-6-4-2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化.第6-4部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列（BGA）封装尺寸的测量方法

2003-06-11

现行

IEC 60191-6-3-2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
半导体器件的机械标准化 - 第6-3部分:表面贴装半导体器件封装外形图的一般规则 - 四方扁平封装的封装尺寸测量方法（qfp）

2000-09-29

现行

GB/T 15879.604-2023

半导体器件的机械标准化 第6-4部分：表面安装半导体器件封装外形图绘制的一般规则 焊球阵列（BGA）封装的尺寸测量方法
Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

2023-05-23