首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 BS EN 60191-6-21:2010
到馆阅读
收藏跟踪
购买正版
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP) 半导体器件的机械标准化
发布日期: 2010-12-31
交叉引用:IEC 60191-4IEC 60191-6EN 60191-4EN 60191-6购买时可用的所有现行修订版均包含在本文件的购买中。
Cross References:IEC 60191-4IEC 60191-6EN 60191-4EN 60191-6All current amendments available at time of purchase are included with the purchase of this document.
分类信息
发布单位或类别: 英国-英国标准学会
关联关系
研制信息
相似标准/计划/法规
现行
BS EN 60191-3-2000
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of integrated circuits
半导体器件的机械标准化 集成电路外形图绘制通则
2000-06-15
现行
IEC 60191-1-2018
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
半导体器件的机械标准化 - 第1部分:分立器件外形图准备的一般规则
2018-01-23
现行
IEC 60191-6-2009
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
半导体器件机械标准化 - 第6部分:表面贴装半导体器件封装外形图准备的一般规则
2009-11-26
现行
BS EN 60191-6-10-2003
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Dimensions of P-VSON
半导体器件的机械标准化
2004-03-31
现行
IEC 60191-3-1999
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
半导体器件的机械标准化.第3部分:集成电路外形图编制的一般规则
1999-10-29
现行
SJ/Z 9021.3-1987
半导体器件的机械标准化 第3部分:集成电路外形图绘制总则
Mechanical standardization of semiconductor devices--Part 3: General rules for the preparation of outline drawings of integrated circuits
1987-09-14
现行
UNE-EN 60191-3-2001
Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits.
半导体器件机械标准化第3部分:集成电路外形图绘制通则
2001-01-31
现行
BS IEC 60191-2-1966+A21-2020
Mechanical standardization of semiconductor devices-Dimensions
半导体器件的机械标准化
2020-04-02
现行
BS EN 60191-6-18-2010
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
半导体器件的机械标准化
2010-10-31
现行
BS EN 60191-6-1-2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for gull-wing lead terminals
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则
2002-03-29
现行
IEC 60191-6-10-2003
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化.第6-10部分:表面安装半导体器件封装外形图制备的一般规则.P-VSON的尺寸
2003-11-19
现行
UNE-EN 60191-6-10-2004
Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化第6-10部分:表面安装半导体器件封装外形图绘制的一般规则P-VSON的尺寸
2004-05-28
现行
BS EN 60191-6-5-2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for fine-pitchball grid array (FBGA)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则
2001-11-15
现行
SJ/Z 9021.1-1987
半导体器件的机械标准化 第1部分:半导体器件图形绘制
Mechanical standardization of semiconductor devices--Part 1: Preparation of drawings of semiconductor devices
1987-09-14
现行
BS 05/30129010 DC
IEC 60191-1 ED.2. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
IEC 60191-1第2版 半导体器件的机械标准化 第一部分 分立器件外形图绘制通则
2005-02-09
现行
BS EN 60191-6-12-2011
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
半导体器件的机械标准化
2011-08-31
现行
BS EN 60191-6-4-2003
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则
2003-08-04
现行
BS EN 60749-1-2003
Semiconductor devices. Mechanical and climatic test methods-General
半导体器件 机械和气候试验方法
2003-07-07
现行
BS EN 60191-6-8-2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for glass sealed ceramic quad flatpack (G-QFP)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则
2001-11-16
现行
IEC 60191-6-18-2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
半导体器件的机械标准化 - 第6-18部分:表面安装半导体器件封装外形图的准备通则 - 球栅阵列(BGA)设计指南
2010-01-07