BS EN 60191-6-18:2010-半导体器件的机械标准化-国家数字标准馆

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Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA) 半导体器件的机械标准化

发布日期： 2010-10-31

交叉引用:IEC 60191-6EN 60191-6IEC 60191-6-2IEC 60191-6-4IEC 60191-6-5EN 60191-6-2EN 60191-6-4EN 60191-6-5购买本文件时可获得的所有现行修订均包含在购买本文件中。

Cross References:IEC 60191-6EN 60191-6IEC 60191-6-2IEC 60191-6-4IEC 60191-6-5EN 60191-6-2EN 60191-6-4EN 60191-6-5All current amendments available at time of purchase are included with the purchase of this document.

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发布单位或类别：英国-英国标准学会

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