IEC 60191-6-18:2010-半导体器件的机械标准化 - 第6-18部分:表面安装半导体器件封装外形图的准备通则 - 球栅阵列（BGA）设计指南-国家数字标准馆

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Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) 半导体器件的机械标准化 - 第6-18部分:表面安装半导体器件封装外形图的准备通则 - 球栅阵列（BGA）设计指南

发布日期： 2010-01-07

IEC 60191-6-18:2010提供了终端间距为1mm或更大的全方形球栅阵列封装（BGA）的标准外形图、尺寸和建议的变化。本标准取消并取代2008年发布的IEC/PAS 60191-6-18。第一版为技术修订版。
2010年5月和2010年7月勘误表的内容已包含在本副本中。

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision.
The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.

分类信息

发布单位或类别：国际组织-国际电工委员会

ICS分类： 31.080.01半导体分立器件 - 半导体器分立件综合

关联关系

研制信息

归口单位： TC 47/SC 47D

相似标准/计划/法规

IEC 60191-2-1966/AMD18-2011

Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
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BS 08/30175763 DC

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IEC 60191-2-1966/AMD6-2002

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IEC 60191-6-10-2003

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UNE-EN 60191-6-10-2004

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Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
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IEC 60191-6-16-2007

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
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IEC 60191-6-1-2001

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UNE-EN 60191-6-1-2002

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BS 05/30132036 DC

IEC 60191-6-16. Mechanical standardization of semiconductor devices. Part 6-16. Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA
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BS 10/30227781 DC

BS EN 60191-6-1. Mechanical standardization of semiconductor devices. Part 6-1. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals
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DIN EN 60191-6-6

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
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IEC 60191-6-12-2011

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IEC 60191-6-5-2001

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IEC 60191-6-4-2003

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