半导体器件的机械标准化 第１部分：半导体器件图形绘制
Mechanical standardization of semiconductor devices--Part 1: Preparation of drawings of semiconductor devices

1987-09-14

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
半导体器件机械标准化 - 第6部分:表面贴装半导体器件封装外形图准备的一般规则

2009-11-26

Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
修改件6——半导体器件的机械标准化 第2部分:尺寸

2002-05-01

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
半导体器件的机械标准化 - 第1部分:分立器件外形图准备的一般规则

2018-01-23

반도체 소자－기계 및 기후적 환경 시험 방법－제1부：일반 사항
半导体器件机械和气候试验方法第1部分:总则

2006-11-30

반도체 소자－기계 및 기후적 환경 시험 방법－제1부：일반 사항
半导体器件机械和气候试验方法第1部分:总则

2006-11-30

Semiconductor devices - Mechanical and climatic test methods - Part 1: General
半导体器件 - 机械和气候测试方法 - 第1部分:总则

2002-08-30

Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
半导体器件机械和气候试验方法第1部分:总则

2004-05-28

半导体器件 机械和气候试验方法 第1部分: 总则
Semiconductor devices―Mechanical and climatic test methods―Part 1: General

2006-08-23

BS EN 60191-6-1. Mechanical standardization of semiconductor devices. Part 6-1. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals
英国标准EN 60191-6-1 半导体器件的机械标准化 第6-1部分 表面安装半导体器件封装外形图绘制的一般规则 鸥翼引线端子设计指南

2010-05-06

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
半导体器件的机械标准化 - 第6-1部分:表面贴装半导体器件封装外形图的一般规则 - 鸥翼引线端子设计指南

2001-10-30

Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件1.半导体器件的机械标准化.第2部分:尺寸

2001-03-15

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化.第6-10部分:表面安装半导体器件封装外形图制备的一般规则.P-VSON的尺寸

2003-11-19

Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化第6-10部分:表面安装半导体器件封装外形图绘制的一般规则P-VSON的尺寸

2004-05-28

BS EN 60191-6. Mechanical standardization of semiconductor devices. Part 6. General rules for the preparation of outline drawings of surface mounted semicondutor device packages
英国标准EN 60191-6 半导体器件的机械标准化 第六部分 表面安装半导体器件封装外形图绘制通则

2007-06-25

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001
半导体器件的机械标准化.第6-1部分:表面安装半导体器件封装外形图绘制的一般规则；鸥翼引线端子设计指南（IEC 60191-6-1-2001）；德文版EN 60191-6-1:2001

2002-08-01

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
半导体器件的机械标准化 - 第6-6部分:表面贴装半导体器件封装外形图准备的一般规则 - 精细间距土地网格阵列（flga）设计指南

2001-03-22

Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
半导体器件的机械标准化第6-6部分:表面安装半导体器件封装外形图绘制的一般规则细间距栅极阵列（FLGA）设计指南

2002-03-21

IEC 60191-1 ED.2. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
IEC 60191-1第2版 半导体器件的机械标准化 第一部分 分立器件外形图绘制通则

2005-02-09

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
半导体器件的机械标准化.第6-16部分:BGA、LGA、FBGA和FLGA用半导体测试和老化插座词汇表

2007-04-26