Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
修改件6——半导体器件的机械标准化 第2部分:尺寸

2002-05-01

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
半导体器件机械标准化 - 第6部分:表面贴装半导体器件封装外形图准备的一般规则

2009-11-26

IEC 60191-6-16. Mechanical standardization of semiconductor devices. Part 6-16. Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA
IEC 60191-6-16 半导体器件的机械标准化 第6-16部分 BGA、LGA、FBGA和FLGA用半导体测试和老化插座词汇表

2005-04-27

BS EN 60191-6. Mechanical standardization of semiconductor devices. Part 6. General rules for the preparation of outline drawings of surface mounted semicondutor device packages
英国标准EN 60191-6 半导体器件的机械标准化 第六部分 表面安装半导体器件封装外形图绘制通则

2007-06-25

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
半导体器件的机械标准化.第6-6部分:表面安装半导体器件封装外形图绘制的一般规则；细间距地栅阵列（FLGA）的设计指南（IEC 60191-6-6-2001）；德文版本EN 60191-6-6:2001

2002-02-01

Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
半导体器件 - 机械和气候测试方法 - 第6部分:高温储存

2017-03-03

반도체 소자 — 기계 및 기후적 환경 시험방법 — 제6부: 고온에서의 저장
半导体器件 - 机械和气候测试方法 - 第6部分:高温储存

2020-07-23

Semiconductor devices - Mechanical and climatic test methods -- Part 6: Storage at high temperature.
半导体器件.机械和气候试验方法.第6部分:高温贮存

2003-05-30

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
半导体器件的机械标准化.第6-16部分:BGA、LGA、FBGA和FLGA用半导体测试和老化插座词汇表

2007-04-26

Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
半导体器件的机械标准化第6-6部分:表面安装半导体器件封装外形图绘制的一般规则细间距栅极阵列（FLGA）设计指南

2002-03-21

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007
半导体器件的机械标准化.第6-16部分:BGA LGA FBGA和FLGA用半导体试验和老化插座术语表（IEC 60191-6-16-2007）；德文版EN 60191-6-16:2007

2007-11-01

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化.第6-10部分:表面安装半导体器件封装外形图制备的一般规则.P-VSON的尺寸

2003-11-19

Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化第6-10部分:表面安装半导体器件封装外形图绘制的一般规则P-VSON的尺寸

2004-05-28

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003
半导体器件的机械标准化第6-10部分:表面安装半导体器件封装外形图绘制的一般规则P-VSON的尺寸（IEC 60191-6-10-2003）；德文版EN 60191-6-10:2003

2004-05-01

BS EN 60191-6-19. Mechanical standardization of semiconductor devices. Part 6-19. Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
英国标准EN 60191-6-19 半导体器件的机械标准化 第6-19部分 包装高温翘曲和最大允许翘曲的测量方法

2008-01-03

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
半导体器件的机械标准化 - 第6-19部分:高温下封装翘曲的测量方法和最大允许翘曲

2010-02-25

BS EN 60191-6-1. Mechanical standardization of semiconductor devices. Part 6-1. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals
英国标准EN 60191-6-1 半导体器件的机械标准化 第6-1部分 表面安装半导体器件封装外形图绘制的一般规则 鸥翼引线端子设计指南

2010-05-06

BS EN 60191-6-18. Mechanical standardization of semiconductor devices. Part 6-18. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
英国标准EN 60191-6-18 半导体器件的机械标准化 第6-18部分 表面安装半导体器件封装外形图绘制的一般规则 球栅阵列（BGA）设计指南

2008-01-03

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001
半导体器件的机械标准化.第6-1部分:表面安装半导体器件封装外形图绘制的一般规则；鸥翼引线端子设计指南（IEC 60191-6-1-2001）；德文版EN 60191-6-1:2001

2002-08-01

BS EN 60191-6-5. Mechanical standardization of semiconductor devices. Part 6-5. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitch ball grid array (FBGA)
英国标准EN 60191-6-5 半导体器件的机械标准化 第6-5部分 表面安装半导体器件封装外形图绘制的一般规则 细间距球栅阵列（FBGA）设计指南

2009-10-26