IEC 60191-6-1:2001-半导体器件的机械标准化 - 第6-1部分:表面贴装半导体器件封装外形图的一般规则 - 鸥翼引线端子设计指南-国家数字标准馆

现行 IEC 60191-6-1:2001

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Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals 半导体器件的机械标准化 - 第6-1部分:表面贴装半导体器件封装外形图的一般规则 - 鸥翼引线端子设计指南

发布日期： 2001-10-30

涵盖带鸥翼引线的终端形状塑料封装的设计规则要求（例如QFP、SOP、SSOP、TSOP等）

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

分类信息

发布单位或类别：国际组织-国际电工委员会

ICS分类： 31.080.01半导体分立器件 - 半导体器分立件综合

关联关系

研制信息

归口单位： TC 47/SC 47D

相似标准/计划/法规

SJ/Z 9021.1-1987

半导体器件的机械标准化第１部分：半导体器件图形绘制
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IEC 60191-2-1966/AMD6-2002

Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
修改件6——半导体器件的机械标准化第2部分:尺寸

IEC 60191-2-1966/AMD1-2001

Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件1.半导体器件的机械标准化.第2部分:尺寸

IEC 60191-6-2009

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半导体器件机械标准化 - 第6部分:表面贴装半导体器件封装外形图准备的一般规则

BS 10/30227781 DC

BS EN 60191-6-1. Mechanical standardization of semiconductor devices. Part 6-1. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals
英国标准EN 60191-6-1 半导体器件的机械标准化第6-1部分表面安装半导体器件封装外形图绘制的一般规则鸥翼引线端子设计指南

IEC 60191-6-16-2007

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
半导体器件的机械标准化.第6-16部分:BGA、LGA、FBGA和FLGA用半导体测试和老化插座词汇表

IEC 60191-1-2018

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
半导体器件的机械标准化 - 第1部分:分立器件外形图准备的一般规则

UNE-EN 60191-6-1-2002

Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals.
半导体器件的机械标准化第6-1部分:表面安装半导体器件封装外形图绘制的一般规则鸥翼引线端子的设计指南

BS 05/30132036 DC

IEC 60191-6-16. Mechanical standardization of semiconductor devices. Part 6-16. Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA
IEC 60191-6-16 半导体器件的机械标准化第6-16部分 BGA、LGA、FBGA和FLGA用半导体测试和老化插座词汇表

IEC 60191-4-2013/AMD1-2018

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
修改件1.半导体器件的机械标准化.第4部分:半导体器件封装外形的编码系统和分类

DIN EN 60191-6-1

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001
半导体器件的机械标准化.第6-1部分:表面安装半导体器件封装外形图绘制的一般规则；鸥翼引线端子设计指南（IEC 60191-6-1-2001）；德文版EN 60191-6-1:2001

IEC 60191-6-10-2003

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化.第6-10部分:表面安装半导体器件封装外形图制备的一般规则.P-VSON的尺寸

UNE-EN 60191-6-10-2004

Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化第6-10部分:表面安装半导体器件封装外形图绘制的一般规则P-VSON的尺寸

BS 07/30167960 DC

BS EN 60191-6. Mechanical standardization of semiconductor devices. Part 6. General rules for the preparation of outline drawings of surface mounted semicondutor device packages
英国标准EN 60191-6 半导体器件的机械标准化第六部分表面安装半导体器件封装外形图绘制通则

IEC 60191-6-6-2001

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
半导体器件的机械标准化 - 第6-6部分:表面贴装半导体器件封装外形图准备的一般规则 - 精细间距土地网格阵列（flga）设计指南

UNE-EN 60191-6-6-2002

Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
半导体器件的机械标准化第6-6部分:表面安装半导体器件封装外形图绘制的一般规则细间距栅极阵列（FLGA）设计指南

BS 05/30129010 DC

IEC 60191-1 ED.2. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
IEC 60191-1第2版半导体器件的机械标准化第一部分分立器件外形图绘制通则

IEC 60191-6-19-2010

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
半导体器件的机械标准化 - 第6-19部分:高温下封装翘曲的测量方法和最大允许翘曲

IEC 60191-6-18-2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
半导体器件的机械标准化 - 第6-18部分:表面安装半导体器件封装外形图的准备通则 - 球栅阵列（BGA）设计指南

DIN EN 60191-6-6

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
半导体器件的机械标准化.第6-6部分:表面安装半导体器件封装外形图绘制的一般规则；细间距地栅阵列（FLGA）的设计指南（IEC 60191-6-6-2001）；德文版本EN 60191-6-6:2001

《国家标准化发展纲要》提出建设国家数字标准馆，推动标准化工作向数字化、网络化、智能化转型。中国标准化研究院正在全力推进国家数字标准馆建设，力争在2026年底建成“一个中心”和“一个平台”，即全球领先的标准数据资源中心，涵盖标准全生命周期的数字化、网络化、智能化研究与服务平台。

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