BS EN 60191-6-12:2011-半导体器件的机械标准化-国家数字标准馆

现行 BS EN 60191-6-12:2011

到馆阅读

收藏跟踪

购买正版

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA) 半导体器件的机械标准化

发布日期： 2011-08-31

交叉引用:IEC 60191IEC 60191-6EN 60191EN 60191-6购买本文件时可获得的所有现行修改件均包含在购买本文件中。

Cross References:IEC 60191IEC 60191-6EN 60191EN 60191-6All current amendments available at time of purchase are included with the purchase of this document.

分类信息

发布单位或类别：英国-英国标准学会

关联关系

研制信息

相似标准/计划/法规

BS EN 60191-3-2000

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of integrated circuits
半导体器件的机械标准化集成电路外形图绘制通则

IEC 60191-1-2018

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
半导体器件的机械标准化 - 第1部分:分立器件外形图准备的一般规则

IEC 60191-6-2009

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
半导体器件机械标准化 - 第6部分:表面贴装半导体器件封装外形图准备的一般规则

BS EN 60191-6-10-2003

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Dimensions of P-VSON
半导体器件的机械标准化

IEC 60191-3-1999

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
半导体器件的机械标准化.第3部分:集成电路外形图编制的一般规则

SJ/Z 9021.3-1987

半导体器件的机械标准化第３部分：集成电路外形图绘制总则
Mechanical standardization of semiconductor devices--Part 3: General rules for the preparation of outline drawings of integrated circuits

UNE-EN 60191-3-2001

Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits.
半导体器件机械标准化第3部分:集成电路外形图绘制通则

IEC 60191-6-10-2003

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化.第6-10部分:表面安装半导体器件封装外形图制备的一般规则.P-VSON的尺寸

BS EN 60191-6-18-2010

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
半导体器件的机械标准化

BS EN 60191-6-1-2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for gull-wing lead terminals
半导体器件的机械标准化表面安装半导体器件封装外形图绘制通则

UNE-EN 60191-6-10-2004

Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化第6-10部分:表面安装半导体器件封装外形图绘制的一般规则P-VSON的尺寸

BS IEC 60191-2-1966+A21-2020

Mechanical standardization of semiconductor devices-Dimensions
半导体器件的机械标准化

BS EN 60191-6-5-2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for fine-pitchball grid array (FBGA)
半导体器件的机械标准化表面安装半导体器件封装外形图绘制通则

SJ/Z 9021.1-1987

半导体器件的机械标准化第１部分：半导体器件图形绘制
Mechanical standardization of semiconductor devices--Part 1: Preparation of drawings of semiconductor devices

BS EN 60749-1-2003

Semiconductor devices. Mechanical and climatic test methods-General
半导体器件机械和气候试验方法

BS 05/30129010 DC

IEC 60191-1 ED.2. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
IEC 60191-1第2版半导体器件的机械标准化第一部分分立器件外形图绘制通则

BS EN 60191-6-21-2010

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化

BS EN 60191-6-4-2003

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化表面安装半导体器件封装外形图绘制通则

IEC 60191-6-18-2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
半导体器件的机械标准化 - 第6-18部分:表面安装半导体器件封装外形图的准备通则 - 球栅阵列（BGA）设计指南

IEC 60191-6-1-2001

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
半导体器件的机械标准化 - 第6-1部分:表面贴装半导体器件封装外形图的一般规则 - 鸥翼引线端子设计指南

《国家标准化发展纲要》提出建设国家数字标准馆，推动标准化工作向数字化、网络化、智能化转型。中国标准化研究院正在全力推进国家数字标准馆建设，力争在2026年底建成“一个中心”和“一个平台”，即全球领先的标准数据资源中心，涵盖标准全生命周期的数字化、网络化、智能化研究与服务平台。

专题数据库

标准管理系统

大数据分析系统

标准智能研制系统