SEMICONDUCTOR DEVICE, DIODE, NON-HERMETIC, EPOXY, SURFACE MOUNT, SILICON, BIDIRECTIONAL TRANSIENT VOLTAGE SUPPRESSOR, TYPES 1N6036AUEG THROUGH 1N6072AUEG, 1N6036AUEJ THROUGH 1N6072AUEJ, JAN, JANTX, AND JANTXV
半导体器件 二极管 非密封 环氧树脂 表面贴装 硅 双向瞬态电压抑制器 类型1n6036ueg到1N6072AUEG 1n6036 uej到1n6082auej JAN JANTX和JANTXV

2020-02-26

SEMICONDUCTOR DEVICE, DIODE, NON-HERMETIC, EPOXY, SURFACE MOUNT, SILICON, BIDIRECTIONAL TRANSIENT VOLTAGE SUPPRESSOR, TYPES 1N6036AUEG THROUGH 1N6072AUEG, 1N6036AUEJ THROUGH 1N6072AUEJ, JAN, JANTX, AND JANTXV
半导体器件 二极管 非密封 环氧树脂 表面贴装 硅 双向瞬态电压抑制器 类型1N6036AUEG至1N6072AUEG 1N6036AUEJ至1N6072AUEJ JAN JANTX和JANTXV

2005-05-09

Semiconductor devices. Mechanical and climatic test methods-Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件 机械和气候试验方法

2020-09-30

SEMICONDUCTOR DEVICE, DIODE, NON-HERMETIC, EPOXY, SURFACE MOUNT, SILICON, UNIPOLAR TRANSIENT VOLTAGE SUPPRESSOR TYPES 1N5555UEG THROUGH 1N5558UEG, 1N5555UEJ THROUGH 1N5558UEJ, 1N5629AUEG THROUGH 1N5665AUEG, 1N5629AUEJ THROUGH 1N5665AUEJ, 1N5907UEG, 1N5907
半导体器件 二极管 非密封 环氧树脂 表面贴装 硅 单极瞬态电压抑制器类型1N5555UEG到1N5558UEG 1n5555 uej到1n555 8uej 1n5629 ueg到1 n5665 ueg 1 n5629 ue j到1n 5665 uej 1 n5907

2020-02-26

SEMICONDUCTOR DEVICE, DIODE, NON-HERMETIC, EPOXY, SURFACE MOUNT, SILICON, UNIPOLAR TRANSIENT VOLTAGE SUPPRESSOR TYPES 1N5555UEG THROUGH 1N5558UEG, 1N5555UEJ THROUGH 1N5558UEJ, 1N5629AUEG THROUGH 1N5665AUEG, 1N5629AUEJ THROUGH 1N5665AUEJ, 1N5907UEG, 1N5907
半导体器件 二极管 非密封 环氧树脂 表面贴装 硅 单极瞬态电压抑制器类型1N5555UEG至1N5558UEG 1N5555UEJ至1N5558UEJ 1N5629AUEG至1N5665AUEG 1N5629AUEJ至1N5665AUEJ 1N5907UEG 1N5907

2005-04-28

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件.机械和气候试验方法.第30部分:可靠性试验前非密封表面安装器件的预处理

2020-08-17

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件 - 机械和气候测试方法 - 第30部分:在可靠性测试之前对非密封性表面贴装器件进行预处理

2020-08-17

Semiconductor devices - Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件机械和气候试验方法第30部分:可靠性试验前非密封表面安装器件的预处理

2005-11-02

半导体器件 机械和气候试验方法 第30部分：非密封表面安装器件在可靠性试验前的预处理
Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2018-09-17

Semiconductor Device, Diode, Non-Hermetic, Epoxy, Surface Mount, Silicon, Unipolar Transient Voltage Suppressor Types 1N5555UEG through 1N5558UEG, 1N5555UEJ through 1N5558UEJ, 1N5629AUEG through 1N5665AUEG, 1N5629AUEJ through 1N5665AUEJ, 1N5907UEG, 1N5907UEJ JAN, JANTX, and JANTXV
半导体器件 二极管 非密封 环氧树脂 表面安装 硅 单极瞬态电压抑制器类型1N5555UEG至1N5558UEG 1N5555UE至1N55518UEJ 1N5629AUEG至IN5665AUEG IN5629AUEJ至1N5665AUEJ IN5907UEG IN 5907UEJ JAN JANTX和JANTXV

2015-03-18