Semiconductor Device, Diode, Non-Hermetic, Epoxy Surface Mount, Silicon, Bidirectional Transient Voltage Suppressor, Types 1N6036AUEG through 1N6072AUEG, 1N6036AUEJ through 1N6072AUEJ, JAN, JANTX, and JANTXV
半导体器件 二极管 非密封 环氧表面安装 硅 双向瞬态电压抑制器 1N6036AUEG至1N6072AUEG 1N6036A UEJ至1N6072AUEJ JAN JANTX和JANTXV型

2015-03-18

SEMICONDUCTOR DEVICE, DIODE, NON-HERMETIC, EPOXY, SURFACE MOUNT, SILICON, BIDIRECTIONAL TRANSIENT VOLTAGE SUPPRESSOR, TYPES 1N6036AUEG THROUGH 1N6072AUEG, 1N6036AUEJ THROUGH 1N6072AUEJ, JAN, JANTX, AND JANTXV
半导体器件 二极管 非密封 环氧树脂 表面贴装 硅 双向瞬态电压抑制器 类型1n6036ueg到1N6072AUEG 1n6036 uej到1n6082auej JAN JANTX和JANTXV

2020-02-26

SEMICONDUCTOR DEVICE, DIODE, NON-HERMETIC, EPOXY, SURFACE MOUNT, SILICON, BIDIRECTIONAL TRANSIENT VOLTAGE SUPPRESSOR, TYPES 1N6036AUEG THROUGH 1N6072AUEG, 1N6036AUEJ THROUGH 1N6072AUEJ, JAN, JANTX, AND JANTXV
半导体器件 二极管 非密封 环氧树脂 表面贴装 硅 双向瞬态电压抑制器 类型1N6036AUEG至1N6072AUEG 1N6036AUEJ至1N6072AUEJ JAN JANTX和JANTXV

2005-05-09

Semiconductor devices. Mechanical and climatic test methods-Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件 机械和气候试验方法

2020-09-30

SEMICONDUCTOR DEVICE, DIODE, NON-HERMETIC, EPOXY, SURFACE MOUNT, SILICON, UNIPOLAR TRANSIENT VOLTAGE SUPPRESSOR TYPES 1N5555UEG THROUGH 1N5558UEG, 1N5555UEJ THROUGH 1N5558UEJ, 1N5629AUEG THROUGH 1N5665AUEG, 1N5629AUEJ THROUGH 1N5665AUEJ, 1N5907UEG, 1N5907
半导体器件 二极管 非密封 环氧树脂 表面贴装 硅 单极瞬态电压抑制器类型1N5555UEG到1N5558UEG 1n5555 uej到1n555 8uej 1n5629 ueg到1 n5665 ueg 1 n5629 ue j到1n 5665 uej 1 n5907

2020-02-26

SEMICONDUCTOR DEVICE, DIODE, NON-HERMETIC, EPOXY, SURFACE MOUNT, SILICON, UNIPOLAR TRANSIENT VOLTAGE SUPPRESSOR TYPES 1N5555UEG THROUGH 1N5558UEG, 1N5555UEJ THROUGH 1N5558UEJ, 1N5629AUEG THROUGH 1N5665AUEG, 1N5629AUEJ THROUGH 1N5665AUEJ, 1N5907UEG, 1N5907
半导体器件 二极管 非密封 环氧树脂 表面贴装 硅 单极瞬态电压抑制器类型1N5555UEG至1N5558UEG 1N5555UEJ至1N5558UEJ 1N5629AUEG至1N5665AUEG 1N5629AUEJ至1N5665AUEJ 1N5907UEG 1N5907

2005-04-28

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件.机械和气候试验方法.第30部分:可靠性试验前非密封表面安装器件的预处理

2020-08-17

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件 - 机械和气候测试方法 - 第30部分:在可靠性测试之前对非密封性表面贴装器件进行预处理

2020-08-17

Semiconductor devices - Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件机械和气候试验方法第30部分:可靠性试验前非密封表面安装器件的预处理

2005-11-02

半导体器件 机械和气候试验方法 第30部分：非密封表面安装器件在可靠性试验前的预处理
Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2018-09-17