本文件规定了通过扫描电子显微镜（SEM）检查横截面来测量金属和其他无机涂层局部厚度的破坏性方法。该方法适用于厚度高达几毫米的涂层，但对于这种厚度的涂层，通常更实用的方法是使用光学显微镜（见ISO？1463）。厚度下限取决于达到的测量不确定度（见第10条）。 注:当有机层既不因制备横截面而受损，也不因成像期间的电子束而受损时，该方法也可用于有机层。

This document specifies a destructive method for the measurement of the local thickness of metallic and other inorganic coatings by examination of cross-sections with a scanning electron microscope (SEM). The method is applicable for thicknesses up to several millimetres, but for such thick coatings it is usually more practical to use a light microscope (see ISO？1463). The lower thickness limit depends on the achieved measurement uncertainty (see Clause？10). NOTE？The method can also be used for organic layers when they are neither damaged by the preparation of the cross-section nor by the electron beam during imaging.