本文向读者介绍了三坐标测量机（CMM）上使用的触觉探针传感器的最新发展，这是由固态应变计传感器的应用、最新的定制芯片和混合电路技术实现的。讨论了微型探针传感器的基本电子功能，详细说明了专用集成电路（ASIC）和混合电路的选择及其局限性。介绍了与智能探针传感器通信以优化CMM/探针系统性能的优势。还探讨了实现更小智能传感器所需的未来硅技术。

THIS PAPER INTRODUCES THE READER TO NEW DEVELOPMENTS IN TACTILE PROBE SENSORS FOR USE ON COORDINATE MEASURING MACHINES (CMM) MADE POSSIBLE BY THE APPLICATION OF SOLID-STATE STRAIN-GAGE SENSORS AND THE LATEST CUSTOM CHIP AND HYBRID CIRCUIT TECHNIQUES. BASIC ELECTRONIC FUNCTIONS FOR A MINIATURE PROBE SENSOR ARE DISCUSSED AND THE SELECTION OF APPLICATION SPECIFIC INTEGRATED CIRCUITS (ASIC) AND HYBRID CIRCUITS ARE EXPLAINED IN DETAIL, ALONG WITH THEIR LIMITATIONS. THE ADVANTAGES OF COMMUNICATING WITH INTELLIGENT-PROBE SENSORS TO OPTIMISE THE CMM/PROBE SYSTEM PERFORMANCE ARE PRESENTED. THE FUTURE SILICON TECHNOLOGY NEEDED TO ACHIEVE SMALLER INTELLIGENT SENSORS IS ALSO EXPLORED.