现行

KS M 1073(2023 Confirm)

전기ㆍ전자 부품 소재용 외포장 종이의 납 정량방법
电子瓦楞纸板中铅的测定

2008-12-19

现行

SN/T 1634-2005

瓦楞纸扳中镉、铬、铅、汞的测定
Determination of cadmium,chromium,lead and mercury in corrugated boards

2005-08-18

现行

GOST 22186-1993

Картон гофрированный. Метод определения толщины
瓦楞纸板 厚度测定方法

1993-10-21

现行

GOST 22981-1978

Картон гофрированный. Метод определения сопротивления расслаиванию
瓦楞纸板 确定分离抗性的方法

现行

TAPPI T 844 om-21

Determining construction (nominal basis weight) of corrugated board
瓦楞纸板结构（公称基重）的测定

现行

TAPPI T 844 om-21

Determining construction (nominal basis weight) of corrugated board
瓦楞纸板结构（公称基重）的测定

现行

UNE-EN 12498-2006

Paper and board - Paper and board intended to come into contact with foodstuffs - Determination of cadmium and lead in an aqueous extract
纸和纸板.与食品接触的纸和纸板.水提取物中镉和铅的测定

2006-07-12

现行

DIN 5058

Packaging - Determination of the bottom bending - Fruit and vegetable trays made of corrugated fibreboard and solid board
包装.底部弯曲度的测定.瓦楞纤维板和实心板制成的水果和蔬菜托盘

2022-01-01

现行

NAS 975 Rev.1

Component Lead Cutting and Forming Equipment Electronic Printed Circuit Board - Inactive for New Design
元件引线切割和成型设备电子印刷电路板-不适用于新设计

2012-07-31

现行

GOST 29137-1991

Формовка выводов и установка изделий электронной техники на печатные платы. Общие требования и нормы конструирования
引线成型和电子部件插入到PC板上 一般要求和设计规范

现行

BS EN 12498-2018

Paper and board. Paper and board intended to come into contact with foodstuffs. Determination of cadmium, chromium and lead in an aqueous extract
纸和纸板 与食品接触的纸和纸板 水提取物中镉、铬和铅的测定

2018-11-28

现行

EIA 166

Standard for Plans to Determine Lead Content of Electronic Components and Related Equipment
电子元件和相关设备铅含量测定计划标准

2019-02-01

现行

ECA/EIA ECCB-952

Standard for Plans to Determine Lead Content of Electronic Components and Related Equipment
电子元件和相关设备铅含量测定计划标准

2004-09-14

现行

KS C IEC 62321-5(2019 Confirm)

전기전자 제품에서 특정 물질의 정량 — 제5부: AAS, AFS, ICP-OES 또는 ICP-MS에 의한 폴리머와 전기전자 부품에서 카드뮴과 납 및 크로뮴의 분석과 금속에서 카드뮴과 납의 분석
的电工产品中某些物质的测定 - 第5部分:在聚合物和电子和镉铬镉 铅和并且在由AAS金属铅 AFS ICP-OES和ICP-MS

2014-12-24

现行

KS C IEC 62321-5(2024 Confirm)

전기전자 제품에서 특정 물질의 정량 — 제5부: AAS, AFS, ICP-OES 또는 ICP-MS에 의한 폴리머와 전기전자 부품에서 카드뮴과 납 및 크로뮴의 분석과 금속에서 카드뮴과 납의 분석
电工产品中某些物质的测定第5部分:聚合物和电子产品中的镉、铅和铬

2014-12-24

现行

SJ/T 10905-1996

电子玻璃中氧化铅的分析　萃取分离－ＥＤＴＡ络合物滴定法
Determination of lead oxide in electronic glass--Extraction/EDTA complexometric titration method

1996-11-20

现行

GB/T 24991-2010

纸、纸板和纸浆 铅含量的测定 石墨炉原子吸收法
Paper,board and pulps - Determination of lead content - Graphite furnace atomic absorption spectrometry method

2010-08-09

现行

SN/T 2004.7-2006

电子电气产品中铅、镉的测定 第7部分：原子荧光光谱法
Determination of lead,cadmium in electrical and electronic equipment-Part 7:Atomic fluorescence spectrometry

2006-08-28

现行

SJ/T 3228.10-2016

电子产品用高纯石英砂 第10部分:铅的测定
High purity arenaceous quartz for used in electronics part 10 determining the content of lead

2016-01-15

现行

GB/T 39560.5-2021

电子电气产品中某些物质的测定 第5部分： AAS、AFS、ICP-OES和ICP-MS法测定聚合物和电子件中镉、铅、铬以及金属中镉、铅的含量
Determination of certain substances in electrical and electronic products—Part 5: Cadmium，lead and chromium in polymers and electronics and cadmium and lead in metals by AAS，AFS，ICP-OES and ICP-MS

2021-10-11