本文简要介绍了感应加热原理和包括Radyne Hi bond?在内的线材加热的具体应用?PC线材的加工、扩散、退火、低松弛、淬火和回火,以及去除溶剂的加热。
This paper gives a brief introduction to induction heating principles and specific applications for wire heat including the Radyne Hi-bond? process for PC wire, diffusion, annealing, low relaxation, hardening and tempering, and heating for the removal of solvents.