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现行 BS EN 60512-12-2:2006
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Connectors for electronic equipment. Tests and measurements-Soldering tests. Test 12b. Solderability, wetting, soldering iron method 电子设备用连接器 测试和测量 焊接测试 测试12b 可焊性、润湿性、烙铁法
发布日期: 2007-03-30
交叉引用:IEC 60068-2-20:1979IEC 60068-2-20:1979/AMD 2:1987IEC 60512-1-1CENELEC HD 323.2.20 S3:1988EN 60512-1-1:2002EN 60512-1EN 60512-1-100
Cross References:IEC 60068-2-20:1979IEC 60068-2-20:1979/AMD 2:1987IEC 60512-1-1CENELEC HD 323.2.20 S3:1988EN 60512-1-1:2002EN 60512-1EN 60512-1-100
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发布单位或类别: 英国-英国标准学会
关联关系
研制信息
相似标准/计划/法规
现行
BS EN 60512-12-3-2006
Connectors for electronic equipment. Tests and measurements-Soldering tests-Solderability, de-wetting
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2007-03-30
现行
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Connectors for electronic equipment. Tests and measurements-Soldering tests-Test 12a. Solderability, wetting, solder bath method
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2006-06-30
现行
BS EN 60512-12-5-2006
Connectors for electronic equipment. Tests and measurements-Soldering tests. Test 12e. Resistance to soldering heat, soldering iron method
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2006-04-28
现行
BS EN 60512-12-4-2006
Connectors for electronic equipment. Tests and measurements-Soldering tests. Test 12d. Resistance to soldering heat, solder bath method
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2007-03-12
现行
IEC 60512-12-1-2006
Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method
电子设备连接器 - 测试和测量 - 第12-1部分:焊接测试 - 测试12a:可焊性 润湿 焊锡方法
2006-03-23
现行
IEC 60512-12-2-2006
Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method
电子设备连接器 - 测试和测量 - 第12-2部分:焊接测试 - 测试12b:可焊性 润湿 焊接铁法
2006-02-13
现行
IEC 60512-12-3-2006
Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting
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2006-02-13
现行
IEC 60512-12-4-2006
Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method
电子设备连接器 - 测试和测量 - 第12-4部分:焊接测试 - 测试12d:耐焊接热 焊锡法
2006-02-13
现行
IEC 60512-12-5-2006
Connectors for electronic equipment - Tests and measurements - Part 12-5: Soldering tests - Test 12e: Resistance to soldering heat, soldering iron method
电子设备连接器 - 测试和测量第12-5部分:焊接测试 - 测试12e:耐焊接热 焊铁方法
2006-02-13
现行
IEC 60512-12-7-2001
Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method
电子设备连接器 - 试验和测量 - 第12-7部分:焊接试验 - 试验12G:可焊性 润湿平衡法
2001-01-24
现行
JIS C 5402-12-7-2005
Connectors for electronic equipment -- Tests and measurements -- Part 12-7: Soldering tests -- Test 12g: Solderability, wetting balance method
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2005-01-01
现行
UNE-EN 60512-12-7-2002
Connectors for electronic equipment - Tests and measurements -- Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method.
电子设备用连接器.试验和测量.第12-7部分:焊接试验.试验12g:可焊性.湿平衡法
2002-09-30
现行
UNE-EN 60512-12-2-2006
Connectors for electronic equipment - Tests and measurements -- Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method. (IEC 60512-12-2:2006)
电子设备用连接器.试验和测量.第12-2部分:焊接试验.试验12b:可焊性 润湿 烙铁法 (IEC 60512-12-2-2006)
2006-06-21
现行
UNE-EN 60512-12-1-2007
Connectors for electronic equipment - Tests and measurements -- Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method (IEC 60512-12-1:2006).
电子设备用连接器.试验和测量.第12-1部分:焊接试验.试验12a:可焊性 润湿 焊浴法(IEC 60512-12-1-2006)
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现行
UNE-EN 60512-12-3-2006
Connectors for electronic equipment - Tests and measurements -- Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting (IEC 60512-12-3:2006).
电子设备用连接器.试验和测量.第12-3部分:焊接试验.试验12c:可焊性 去湿性(IEC 60512-12-3-2006)
2006-12-13
现行
UNE-EN 60512-12-5-2006
Connectors for electronic equipment - Tests and measurements -- Part 12-5: Soldering tests - Test 12e: Resistance to soldering heat, soldering iron method (IEC 60512-12-5:2006).
电子设备用连接器.试验和测量.第12-5部分:焊接试验.试验12e:耐焊接热 烙铁法(IEC 60512-12-5-2006)
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现行
UNE-EN 60512-12-4-2006
Connectors for electronic equipment - Tests and measurements -- Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method (IEC 60512-12-4:2006).
电子设备用连接器.试验和测量.第12-4部分:焊接试验.试验12d:耐焊接热 锡槽法(IEC 60512-12-4-2006)
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