BS 9612 N017:1979-振荡器用电阻焊接密封石英晶体元件详细规范 DN、DZ、DQ和DP外壳频率范围为0.8至20 MHz和3.0至30 MHz 基本厚度剪切模式切割时用于窄温度范围内的操作（温度控制）全速-国家数字标准馆

现行 BS 9612 N017:1979

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Detail specification for resistance welded seal quartz crystal units for oscillator applications. DN, DZ, DQ and DP enclosures, 0.8 to 20 MHz and 3.0 to 30 MHz frequency ranges. Fundamental thickness-shear mode, AT-cut, for operation over narrow temperature ranges (temperature controlled). Full assessment level 振荡器用电阻焊接密封石英晶体元件详细规范 DN、DZ、DQ和DP外壳频率范围为0.8至20 MHz和3.0至30 MHz 基本厚度剪切模式切割时用于窄温度范围内的操作（温度控制）全速

发布日期： 1979-04-15

额定值、特性和检验要求。交叉引用:BS 2011BS 5069:第1BS 6001BS 9000BS 9610PD 9002部分

Ratings, characteristics and inspection requirements.Cross References:BS 2011BS 5069:Part 1BS 6001BS 9000BS 9610PD 9002

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发布单位或类别：英国-英国标准学会

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BS 9612 N021-1979

Detail specification for resistance welded seal quartz crystal units for oscillator applications. DN, DZ, DQ and DP enclosures, 50 to 125 MHz frequency range. Fifth overtone thickness-shear mode, AT-cut, for operation over narrow temperature ranges (temperature controlled). Full assessment level
振荡器用电阻焊接密封石英晶体元件详细规范 DN、DZ、DQ和DP外壳频率范围为50至125 MHz 第五泛音厚度剪切模式切割时用于窄温度范围内的操作（温度控制）全面评估水平

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Detail specification for resistance welded seal quartz crystal units for oscillator applications. DN, DZ, DQ and DP enclosures, 17 to 75 MHz frequency range. Third overtone thickness-shear mode, AT-cut, for operation over narrow temperature ranges (temperature controlled). Full assessment level
振荡器用电阻焊接密封石英晶体元件详细规范 DN、DZ、DQ和DP外壳频率范围为17至75 MHz 第三泛音厚度剪切模式切割时用于窄温度范围内的操作（温度控制）全面评估水平

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现行

BS 9612 N020-1979

Detail specification for resistance welded seal quartz crystal units for oscillator applications. DN, DZ, DQ and DP enclosures, 50 to 125 MHz frequency range. Fifth overtone thickness-shear mode, AT-cut, for operation over wide temperature ranges (non-temperature controlled). Full assessment level
振荡器用电阻焊接密封石英晶体元件详细规范 DN、DZ、DQ和DP外壳频率范围为50至125 MHz 第五泛音厚度剪切模式切割时适用于宽温度范围（非温度控制）的操作全面评估水平

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现行

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Detail specification for cold welded seal quartz crystal units for oscillator applications. DK enclosure, 6.0 to 25 MHz frequency range. Fundamental thickness-shear mode, AT-cut, for operation over wide temperature ranges (non-temperature controlled). Full assessment level
振荡器用冷焊密封石英晶体元件详细规范 DK外壳频率范围为6.0至25 MHz 基本厚度剪切模式切割时适用于宽温度范围（非温度控制）的操作全面评估水平

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现行

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现行

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现行

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Detail specification for cold welded seal quartz crystal units for oscillator applications. DN, DQ and DP enclosures, 50 to 125 MHz frequency range. Fifth overtone thickness-shear mode, AT-cut, for operation over wide temperature ranges (non-temperature controlled). Full assessment level
振荡器用冷焊密封石英晶体元件详细规范 DN、DQ和DP外壳频率范围为50至125 MHz 第五泛音厚度剪切模式切割时适用于宽温度范围（非温度控制）的操作全面评估水平

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现行

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振荡器用冷焊密封石英晶体元件详细规范 DN、DQ和DP外壳频率范围为0.8至20 MHz和3.0至30 MHz 基本厚度剪切模式切割时用于窄温度范围内的操作（温度控制）全面评估

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现行

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现行

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